Mofani oa Lefatše oa Tšireletso ea Tikoloho

Bismaleimide (BMI) resin ke thepa e tsoetseng pele ea polymer e tsebahalang haholo bakeng sa ts'ebetso ea eona e ikhethang lits'ebetsong tsa maemo a holimo, haholo indastering ea elektroniki le PCB (Printed Circuit Board). Ka thepa e ikhethang, resin ea BMI e ntse e tsoela pele ho amoheloa e le lisebelisoa tsa bohlokoa bakeng sa ho etsoa ha li-laminate tsa koporo (CCLs), e leng lisebelisoa tsa mantlha tsa li-PCB.

Melemo ea Bohlokoa ea Bismaleimide Resin ho Likopo tsa PCB
1. Tlaase Dielectric Constant (Dk) le Dissipation Factor (Df):
BMI resin e fana ka lisebelisoa tse ntle tsa motlakase tse nang le litekanyetso tse tlase tsa Dk le Df, e leng se etsang hore e be se loketseng bakeng sa mekhoa ea puisano e phahameng le e potlakileng. Thepa ena e bohlokoa bakeng sa ho boloka botšepehi ba matšoao lits'ebetsong tse tsamaisoang ke AI le marang-rang a 5G.
2. Ho Hanyetsa Mocheso:
BMI resin e bonts'a botsitso bo ikhethang ba mocheso, e mamella mocheso o feteletseng ntle le ho senyeha ho hoholo. Thepa ena e etsa hore e tšoanelehe hantle bakeng sa li-PCB tse sebelisoang libakeng tse hlokang ho ts'epahala haholo le ho mamella mocheso, joalo ka sebaka sa sefofane, likoloi le litsamaiso tse tsoetseng pele tsa puisano.
3. Molemo oa Sollubility:
BMI resin e bonts'a ho qhibiliha ho hoholo ho lihlapolli tse tloaelehileng, tse nolofatsang ts'ebetso le ho etsoa ha li-CCL. Tšobotsi ena e tiisa ho kopanngoa hamonate lits'ebetsong tsa tlhahiso, ho fokotsa ho rarahana ha tlhahiso.

Lisebelisoa ho PCB Manufacturing

BMI resin e sebelisoa haholo ho li-CCL tse sebetsang hantle, tse nolofalletsang tlhahiso ea li-PCB bakeng sa lits'ebetso tse kang:
• Mekhoa e tsamaisoang ke AI
• Marang-rang a likhokahano a 5G
• Lisebelisoa tsa IoT
• Litsi tsa data tse potlakileng