Resin ea Epoxy e nang le Brominated
Resin ea epoxy e nang le bromine e tlase e na le ho hanyetsa mocheso hantle, ho lieha ha malakabe, botsitso ba litekanyo le botsitso ba lik'hemik'hale kamora ho fola, le ho monya metsi hanyane. E loketse li-laminate tse koahetsoeng ka koporo, thepa ea ho bopa, le liaparo tse thibelang malakabe, likhomaretsi tse thibelang malakabe le masimo a mang.
| Mofuta | Nomoro ea Grage. | Ponahalo | E tiileng Dikahare (%) | EEW (g/eq) | Ho thibana ha (mpa.s/25℃) | Hy-Cl (ppm) | 'Mala (G.) | Dikahare tsa Bromine (%) |
| Resin epoxy e nang le Brominated e tlase | EMTE 450A80 | Mokelikeli o bonaletsang o mosehla o bobebe | 80±1.0 | 410~440 | 800~1800 | ≤300 | ≤1 | 18~21 |
| Resin epoxy e nang le Brominated e tlase | EMTE 454A80 | Mokelikeli o bonaletsang o bosootho bo bofubelu | 80±1.0 | 410~440 | 800~1800 | ≤500 | 10~12 | 18~21 |
Resin e nang le bromine e ngata EMTE400A60 e na le 'mala o bobebe, e na le bromine e kaalo ka 46-50%, chlorine e nang le hydrolyze e tlase, e na le matla a matle a ho kopanya, e hanyetsa mocheso le e hanyetsa lik'hemik'hale. E sebelisoa haholo ho li-laminate tse koahetsoeng ka koporo tsa elektroniki, li-laminate tsa elektroniki, li-binder tse hanelang mocheso, thepa e kopaneng, liphahlo tse hanelang mocheso o phahameng, boenjiniere ba sechaba le enke tsa elektroniki le masimo a mang.
| Mofuta | Nomoro ea Grage. | Ponahalo | E tiileng Dikahare (%) | EEW (g/eq) | Ho thibana ha (mpa.s/25℃) | Hy-Cl (ppm) | 'Mala (G.) | Dikahare tsa Bromine (%) |
| Resin epoxy e nang le brominate e ngata | EMTE 400A60 | Tharollo e se nang 'mala ho isa ho e mosehla o bobebe | 59~61 | 385~415 | ≤50 | ≤100 | ≤1 | 46~50 |
| Mofuta | Nomoro ea Grage. | Ponahalo | Ntlha ea ho Nolofatsa (℃) | EEW (g/eq) | Kakaretso ea Chlorine (ppm) | Hy-Cl (ppm) | Chlorine e sa pheleng (ppm) | Solvent e setseng (ppm) |
| Resin epoxy e nang le brominate e ngata | EMTE 400 | Sekoli se tiileng se se nang 'mala ho isa ho se mosehla o bobebe | 63~72 | 385~415 | ≤1600 | ≤100 | ≤5 | ≤600 |
