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Fektheri ea Chaena bakeng sa Chaena CNMI Epoxy Resin kristale e hlakileng bakeng sa ho koahela tafole e nyane ea noka ea ho lahla mabenyane a mesebetsi ea matsoho ea terei ea mabenyane ea lebopong
"Ho ipapisitsoe le 'maraka oa lehae le ho holisa khoebo ea mose ho maoatle" ke leano la rona la nts'etsopele bakeng sa Fektheri ea Chaena bakeng sa Chaena CNMI Epoxy Resin kristale e hlakileng bakeng sa ho penta tafole e nyane ea mabenyane ea ho betla mabenyane a matsoho a tafole ea noka, U ka fumana theko e tlase haholo mona. Hape u tla fumana lintho tsa boleng bo holimo le lits'ebeletso tse ntle mona! Ka kopo le ka mohla u se ke ua emela ho re fumana!
"Ho ipapisitsoe le 'maraka oa lehae le ho atolosa khoebo ea mose ho maoatle" ke leano la rona la nts'etsopele bakeng saResin ea Epoxy ea Chaena, resin ea epoxy e se nang chefo, Ka molao-motheo oa ho hapa bohle, re tšepa ho u thusa ho etsa phaello e ngata 'marakeng. Monyetla ha se oa ho tšoaroa, empa oa ho hlahisoa. Lik'hamphani life kapa life tsa khoebo kapa barekisi ba tsoang linaheng life kapa life baa amoheloa.
Litšoantšo tsa Likopo
Resin ea Benzoxazines
Letoto la Low-DK Benzoxazine Resin
Letoto la resin ea epoxy ea Bisphenol
Letoto la resin ea epoxy ea Bisphenol F
Letoto la resin ea phenolic epoxy
Letoto la li-resin tsa epoxy tse nang le phosphorus
Letoto la resin ea epoxy e nang le brominated
Letoto la resin ea epoxy e fetotsoeng ea MDI
Letoto la resin ea epoxy ea macromolecular
Letoto la li-resin tsa DCPD tsa epoxy
Letoto la resin ea epoxy e sebetsang ka mesebetsi e mengata
Letoto la resin ea epoxy ea kristale ea kristale ea kristale/mokelikeli
Letoto la Phenol Formaldehyde Resin
Letoto la li-resin tsa phenolic tse nang le phosphorus
Letoto la resin ea hydrocarbon e fetotsoeng
Letoto la likarolo tsa resin ea hydrocarbon
Ester e sebetsang
Monomer e Ikhethang ea Resin
Letoto la Maleimide Resin
Resin ea Benzoxazines
Khamphani ea rona ke k'hamphani ea pele e entseng tlhahiso e kholo ea indasteri ea Benzoxazine Resin Chaena, 'me e boemong bo ka sehloohong masimong a tlhahiso, ts'ebeliso le lipatlisiso tsa Benzoxazine Resin. Lihlahisoa tsa Benzoxazine Resin tsa k'hamphani ea rona li fetile tlhahlobo ea SGS, 'me ha li na lintho tse kotsi tsa halogen le RoHS (Pb, CD, Hg, Gr (VI), PBBs, PBDEs). Tšobotsi ke hore ha ho na molek'hule e nyane e lokolloang nakong ea ts'ebetso ea ho folisa 'me bophahamo bo batla bo le lerootho; Lihlahisoa tsa ho folisa li na le litšobotsi tsa ho monya metsi a tlase, matla a tlase a bokaholimo, khanyetso e ntle ea UV, khanyetso e ntle ea mocheso, khabone e setseng e ngata, ha ho hlokahale catalysis e matla ea asiti le curing.lt e bulehileng e sebelisoa haholo li-laminate tsa elektroniki tse koahetsoeng ka koporo, li-laminate, lisebelisoa tse kopaneng, lisebelisoa tsa lifofane, lisebelisoa tsa khohlano le masimo a mang.
| Lebitso | Nomoro ea Sehlopha | Ponahalo | ho nolofatsa ntlha (°C) | Mahala Phenol (%) | GT (s @210℃) | Ho thibana ha | NV (%) | thepa |
| Mofuta oa MDA Benzoxazine | DFE125 | Mokelikeli o bonaletsang o mofubelu o sootho | - | ≤ 5 | 100-230 | 30-70 (s,4# 杯) | 70±3 | Tg e phahameng, ho hanyetsa mocheso o phahameng, ho thibela malakabe ntle le halogen, matla a phahameng le ho tiea |
| Mofuta oa BPA Benzoxazine | DFE127 | Mokelikeli o mosehla o bonaletsang | - | ≤ 5 | 1100-1600 | 200-800 Mpa·s | Libeke tse 80 2 | Modulus e phahameng, ho hanyetsa mocheso o phahameng, ho thibela malakabe ntle le halogen, ho monya metsi a tlase |
| Mofuta oa BPA Benzoxazine | DFE127A | Sete e mosehla | 60-85 | ≤ 5 | 500-800 | - | 98±1,5 | Modulus e phahameng, ho hanyetsa mocheso o phahameng, ho thibela malakabe ntle le halogen, ho monya metsi a tlase |
| Mofuta oa BPF Benzoxazine | DFE128 | Mokelikeli o bonaletsang o mofubelu o sootho | - | ≤ 5 | 350-400 | 30-100 (s,4# 杯) | 75±2 | Ho tiea ho hotle, ho hanyetsa mocheso o phahameng, ho thibela malakabe ntle le halogen, ho monya metsi a tlase le ho ba le viscosity e tlase |
| Mofuta oa ODA Benzoxazine | DFE129 | Bofubelu bo bonaletsang bo sootho | - | ≤ 2 | 120-500 | <2000 mpa.s | Libeke tse 65 3 | Tg: 212°C, PlienoK ea mahala≤ 2%， Dkt: 2.92, Df：0.0051 |
Letoto la Low-DK Benzoxazine Resin
Resin ea Benzoxazine e nang le dielectric e tlase ke mofuta oa Resin ea Benzoxazine e etselitsoeng laminate e koahetsoeng ka koporo e nang le maqhubu a phahameng le lebelo le phahameng. Mofuta ona oa resin o na le litšobotsi tsa ho hanyetsa mocheso o phahameng le ho hanyetsa mocheso o phahameng. E sebelisoa haholo ho M2, M4 grade copper clad laminate kapa HDI board, boto ea multilayer, thepa e kopaneng, thepa ea khohlano, thepa ea lifofane le masimo a mang.
| Lebitso | Nomoro ea Sehlopha | Ponahalo | ho nolofatsa ntlha rc> | Mahala Phenol (%) | GT (s @210℃) | Ho thibana ha | NV (%) | thepa |
| Benzoxazine e nang le dielectric e tlase | DFE130 | Tšehla e tšehla kapa e tiileng haholo | 55-80 | ≤ 5 | 400-600 | — | ≥98.5 | Dkt: 2.75 、 Tg: 196 ℃： |
| Ho fola ka potlako ha benzoxazine mochesong o mahareng le o tlase | DFE146 | Mokelikeli o bonaletsang o mosehla o sootho | - | ≤ 5 | 100-130 | <200 (s,4# 杯) | 75±2 | Dk: 3.04, Df: 0.0039 Lebelo le phahameng la ho phekola, Tg e phahameng le dielectric e tlase |
| Benzoxazine e nang le tlamo e habeli | DFE148 | Mokelikeli o bonaletsang o mofubelu o sootho | - | ≤ 5 | 'Nete tekanyo | <2000 Mpa·s | 80±2 | E ka arabela le li-resin tse ling tse nang le maqhama a mabeli |
| Benzoxazine ea ketane e kholo | DFE149 | Mokelikeli o bonaletsang o mosehla o sootho | - | ≤ 3 | 80-160 | <2000 Mpa·s | 70 meqolo 2 | Tg: 215#C, Td5%： 380°C, Dr： 2.87, Df：0.0074 (10GHz) |
| Mofuta oa DCPD Benzoxazine | DFE150 | Mokelikeli o bonaletsang o bosootho bo bofubelu | - | ≤ 3 | 2000-2500 | <1000 Mpa·s | 75±2 | Dkt: 2.85, DF: 0.0073 (10GHz) |
| Bisphenol benzoxazine | DFE153 | Mokelikeli o bonaletsang o mosehla o sootho | 一 | ≤ 3 | 100-200 | <2000 Mpa·s | 70±2 | Dkt： 2.88, DF： 0.0076 (10GHz), |
Letoto la resin ea epoxy ea Bisphenol
Bisphenol Resin ea epoxy ea k'hamphani ea rona e kenyelletsa resin ea epoxy e metsi, resin e tiileng ea epoxy le resin ea epoxy e qhibilihang, e nang le chlorine e fokolang ea hydrolysis 'me e sebelisoa haholo ho penteng, thepa ea elektroniki, thepa e kopaneng le masimo a mang.
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | 'Mala (G) | Ho thibana ha (mPa.s) | Hy-Cl (ppm) |
| Resin ea epoxy e metsi | DFE1126 | 165-175 | ≤0.5 | 3000-5000 | <200 |
| DFE1127 | 180-190 | ≤1 | 8000-11000 | <500 | |
| DFE1128 | 184-194 | ≤1 | 12000-15000 | <500 | |
| DFE1128H | 184-194 | ≤1 | 12000-15000 | <100 | |
| Lebitso | Nomoro ea Sehlopha | EEW(g/eq) | 'Mala (G) | Ntlha ea ho nolofatsa (℃) | |
| Resin epoxy e tiileng ea bisphenol | DFE1011 | 450-500 | ≤1 | 60-70 | |
| DFE1901 | 450-500 | ≤1 | 65-75 | ||
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | 'Mala (G) | Ho thibana ha (mPa.s) | NV (%) |
| Mofuta oa tharollo mokelikeli oa bisphenol A epoxy resin | DFE1901EK70 | 450-500 | ≤1 | 2000-5000 | 70±1 |
Letoto la resin ea epoxy ea Bisphenol F
Resine ea epoxy ea Bisphenol F e na le litšobotsi tsa ho ba le viscosity e tlase, ho phalla hantle le ho ba le mongobo habonolo, 'me k'hamphani ea rona e na le theknoloji e ikemetseng ea tlhahiso ea bisphenol F e nang le lisebelisoa tse tala tse lekaneng. Lihlahisoa li sebelisoa haholo ho lipente tse se nang solvent, ho betsa, likhomaretsi, thepa ea ho futhumatsa le masimo a mang.
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | Ho thibana ha (mPa·s) | 'Mala (G) | Hy-Cl (ppm) |
| Resin epoxy ea bisphenol F e metsi | DFE1160 | 155-165 | ≤1600 | ≤1 | ≤100 |
| DFE1170L | 165-175 | 2900-3500 | ≤1 | ≤100 | |
| DFE1170 | 165-175 | 3500-4500 | ≤1 | ≤100 | |
| DFE1170H | 165-175 | 5000-6000 | ≤1 | ≤100 | |
| DFE1170K | 165-175 | 5000-6000 | ≤1 | ≤200 | |
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | 'Mala (G) | Ntlha ea ho nolofatsa (℃) | |
| Resin epoxy ea bisphenol F e tiileng | DFE1701 | 450-500 | ≤1 | 45-55 | |
| DFE1702 | 600-700 | ≤1 | 75-85 | ||
| DFE1703 | 700-800 | ≤1 | 85-95 | ||
| DFE1704D | 900-1000 | ≤1 | 90-100 | ||
| DFE1707D | 1300-1700 | ≤1 | 100-110 | ||
Letoto la resin ea phenolic epoxy
Li-resin tsa rona tsa phenolic epoxy li kenyelletsa mofuta oa PNE, mofuta oa BNE le mofuta oa CNE. Lihlahisoa tsa tsona tse phekotsoeng li na le bongata bo phahameng ba ho hokahanya, matla a matle a ho kopanya, ho hanyetsa mocheso le ho hanyetsa lik'hemik'hale. Li sebelisoa haholo li-laminate tse koahetsoeng ka koporo ea elektroniki, li-laminate tsa elektroniki, likhomaretsi tse hanelang mocheso, metsoako, liphahlo tsa mocheso o phahameng, boenjiniere ba sechaba le enke ea elektroniki.
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | ntlha ea ho nolofatsa (°C) | 'Mala (G) | Hy-Cl (ppm) |
| Resin ea phenolic epoxy ea mofuta oa PNE | DFE1638 | 171-180 | 36-40 | ≤0.5 | ≤200 |
| DFE1638S | 171-179 | 36-40 | ≤0.5 | ≤200 | |
| DFE1636 | 170-178 | 27-31 | <1 | <300 | |
| DFE1637 | 170-178 | 31-36 | <1 | <300 | |
| DFE1639 | 174-180 | 44-50 | <1 | <300 | |
| DFE1625 | 168-178 | 9000-13000mpa·s | ≤1 | <300 | |
| Resin ea phenolic epoxy ea mofuta oa BNE | DFE1200 | 200-220 | 60-70 | <3 | <500 |
| DFE1200H | 205-225 | 70-80 | <3 | <500 | |
| DFE1200HH | 210-230 | 80-90 | <3 | <500 | |
| Resin ea phenolic epoxy ea mofuta oa CNE | DFE1701 | 196-206 | 65-70 | <2 | <500 |
| DFE1702 | 197-207 | 70-76 | <2 | <500 | |
| DFE1704 | 200-215 | 88-93 | <2 | <1000 | |
| DFE1704M | 200-215 | 83-88 | <2 | <1000 | |
| DFE1704ML | 200-210 | 80-85 | <2 | <1000 | |
| DFE1704L | 207-215 | 78-83 | <2 | <1000 | |
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | Ho thibana ha (mPa.s) | NV (%) | |
| Mofuta oa tharollo phenolic epoxy resin | DFE236 | 200-220 | 1000-4000 | 80±1 | |
| DFE238 | 170-190 | 200-500 | Libeke tse 80 1 | ||
Letoto la li-resin tsa epoxy tse nang le phosphorus
Li-resin tsa epoxy tse nang le phosphorus li kenyelletsa mefuta e meraro haholo-holo, e leng mofuta oa DOPO, mofuta oa DOPO-HQ le mofuta oa DOPO-NQ. Li ntle haholo ho tieheng ha malakabe le ho hanyetsa mocheso, 'me li na le coefficient e tlase ea ho monya metsi le katoloso. Ke tsa resin ea epoxy e thibelang malakabe e se nang halogen, 'me li latela RoHS le WEEE Directive. Li sebelisoa haholo-holo boto ea potoloho e hatisitsoeng e thibelang malakabe e se nang halogen, laminate ea koporo ea elektroniki, laminate ea motlakase le masimo a mang a lihlahisoa.
| Lebitso | Nomoro ea Sehlopha | Ponahalo | NV (%) | EEW (g/eq) | Ho thibana ha (mPa.s) | P% (%) |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO-HQ | DFE200 | Mokelikeli o bonaletsang o bosootho bo bofubelu | 70±1.0 | 320 ±20 | <1000 | 2.0±0.1 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO-HQ | DFE200A | Mokelikeli o bonaletsang o bosootho bo bofubelu | 70±1.0 | 275 ±25 | <1000 | 1.0±0.1 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO-HQ | DFE200C | Mokelikeli o mosehla o bonaletsang | 80±1.0 | 255 ±15 | 1000-7000 | 2.0±0.1 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO-HQ | DFE200D | Mokelikeli o mosehla o bonaletsang | 80±1.0 | 230±20 | 1000-4000 | 1.0±0.1 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO-NQ | DFE201 | Mokelikeli o bonaletsang o bosootho bo bofubelu | 75±1.0 | 330±30 | 1000-3000 | 2.5 ± 0.1 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO-NQ | DFE201A | Mokelikeli o bonaletsang o bosootho bo bofubelu | 75±1.0 | 330 likhato tse 10 | 1500-1700 | 2.5 ± 0.1 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO | DFE202 | Mokelikeli o bonaletsang o se nang 'mala ho isa ho o mosehla o bobebe | 75 ± 1.0 | 315±20 | 1000-3000 | 3.1 ho isa ho 3.2 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO | DFE202A | Mokelikeli o bonaletsang o bosootho bo bofubelu | 70 ± 1.0 | 300±20 | <2000 | 2.4±0.1 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO | DFE202B | Mokelikeli o bonaletsang o se nang 'mala ho isa ho o mosehla o bobebe | 75±1.0 | 310±20 | ≤3000 | 2.8〜3.2 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO | DFE202C | Mokelikeli o hloekileng le o bonaletsang | 75±1.0 | 300±20 | <3000 | 3.1 ± 0.1 |
| Resin epoxy ea phenolic e fetotsoeng ea DOPO | DFE202D | Mokelikeli o bonaletsang o mosehla o bobebe | 70±1.0 | 360 lik'hilograma tse 30 | ≤ 1500 | 2.5 ± 0.2 |
Letoto la resin ea epoxy e nang le brominated
Li-resin tsa epoxy tse nang le brominated ke mofuta oa li-resin tsa epoxy tse thibelang malakabe tsa halogen. Khamphani ea rona e hlahisa li-resin tsa epoxy tse nang le bromine e ngata le tse nang le bromine e tlase, tse nang le monyetla o motle oa ho kenella ka hare ho lesela la khalase, tse thibelang malakabe hantle le tse hanyetsang mocheso, 'me li sebelisoa haholo lefapheng la laminate ea koporo e sa thibeleng malakabe ea halogen.
| Lebitso | Nomoro ea Sehlopha | Ponahalo | NV (%) | EEW (g/eq) | Ho thibana ha (mPa.s) | Br% (%) |
| epoxy resin e nang le bromine e tlase | DFE271 | Mokelikeli o bonaletsang o mosehla ho isa bofubelung bo sootho | 80±1.0 | 250-280 | 200-800 | 11.5±1.0 |
| DFE274 | Mokelikeli o bonaletsang o mosehla ho isa bofubelung bo sootho | 75±1.0 | 280-320 | 200-1500 | 18-21 | |
| DFE276 | Mokelikeli o bonaletsang o mosehla ho isa bofubelung bo sootho | 75 Setšoantšo sa 1.0 | 340-380 | 200-400 | 18-21 | |
| DFE277 | Mokelikeli o bonaletsang o mosehla ho isa bofubelung bo sootho | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| DFE278 | Mokelikeli o bonaletsang o bosootho bo bofubelu | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| Lebitso | Nomoro ea Sehlopha | Ponahalo | EEW (g/eq) | ho nolofatsa ntlha (°C) | Br% (%) | |
| epoxy resin e nang le bromine e ngata | DFE270 | Ha e na 'mala ho isa ho mosehla o tiileng | 380-420 | 67-74 | 46-50 | |
Letoto la resin ea epoxy e fetotsoeng ea MDI
Resin epoxy e fetotsoeng MDI ke epoxy e fetotsoeng Isocyanate e nang le oxazolidinone e kentsweng ketaneng e kgolo, e nang le ho hanyetsa mocheso le ho tenyetseha ho hoholo. Sehlahisoa sena se fumaneha ka ntle ho Boron le Boron, se qhibiliha ka har'a disolvent tse tloaelehileng tse kang propylene glycol methyl ether, acetone, butanone, jj. . E tsamaisana hantle le dicyandiamide, phenolic curing agent, mme e loketse tshimo ya laminate e se nang le lead-free halogen.
| Lebitso | Nomoro ea Sehlopha | Ponahalo | NV (%) | EEW (g/eq) | Ho thibana ha (mPa.s) | Br% (%) |
| Resin epoxy e fetotsoeng brominated e fetotsoeng ke MDI | DFE204 | Mokelikeli o bonaletsang o bosootho bo bofubelu | 75±1.0 | 330-370 | 500-2000 | 16.5-18 |
| DFE204A | Mokelikeli o bonaletsang o bosootho bo bofubelu | 75±1.0 | 330-370 | 500-2000 | 16.5-18 | |
| Resin epoxy e fetotsoeng ea MDI | DFE205 | Mokelikeli o bonaletsang o sootho o mosehla | 75 ± 1.0 | 250-310 | 500-2500 | - |
| DFE205A | Mokelikeli o bonaletsang o sootho o mosehla | 75 ± 1.0 | 270-330 | 500-2500 | - |
Letoto la resin ea epoxy ea macromolecular
Li-resin tsa epoxy tsa macromolecular ke mofuta oa li-resin tsa epoxy tsa bisphenol A/F tse fetotsoeng, tse nang le masapo a limolek'hule a tenyetsehang le likarolo tse telele tsa ketane ea limolek'hule, 'me li na le ho tenyetseha le ho khomarela ho babatsehang. Li sebelisoa hangata litsamaisong tsa resin ea epoxy ho eketsa ho tenyetseha le ho khomarela, le ho ntlafatsa phallo ea resin. Li loketse boto ea potoloho e hatisitsoeng, laminate ea koporo ea elektroniki, sekhomaretsi, thepa e kopaneng, laminate ea motlakase le lihlahisoa tse ling.
| Lebitso | Nomoro ea Sehlopha | Ponahalo | NV (%) | EEW (g/eq) | Ho thibana ha (mPa.s) |
| Resin epoxy ea bisphenol e fetotsoeng | DFE206 | Mokelikeli o bonaletsang o se nang 'mala ho isa ho o mosehla o bobebe | 75 Setšoantšo sa 1.0 | 470±30 | 500-3000 |
| Resin ea Fepoxy ea bisphenol e fetotsoeng | DFE207 | Mokelikeli o bonaletsang o mosehla o bobebe ho isa ho o mofubelu o sootho | 70±1.0 | 550 ±50 | 500-3000 |
Letoto la li-resin tsa DCPD tsa epoxy
Resin ea epoxy ea DCPD ke mofuta oa resin ea epoxy e sebetsang ka bongata e nang le Dk / DF e tlase, e hanyetsang mocheso hantle, e nang le mongobo o tlase, e khomarelang haholo le e hanyetsang lik'hemik'hale. E sebelisoa haholo ho laminate ea koporo e koahetsoeng ka makhetlo a mangata le ka lebelo le phahameng, thepa ea ho bopa, liaparo tse thibelang malakabe, likhomaretsi tse thibelang malakabe le masimo a mang.
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | ntlha ea ho nolofatsa (°C) | Hy-Cl (ppm) |
| Resin epoxy ea DCPD e tiileng | DFE211LL | 260-275 | 53-60 | <300 |
| DFE211L | 265-275 | 60-70 | <300 | |
| DFE211 | 260-280 | 70-80 | <300 | |
| DFE211H | 260-280 | 80-90 | <300 | |
| DFE211HH | 265-285 | 90-100 | <300 | |
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | NV (%) | Ho thibana ha (mPa.s) |
| Tharollo ea resin ea epoxy ea DCPD | DFE210 | 260-280 | 75±1 | 200-800 |
Letoto la resin ea epoxy e sebetsang ka mesebetsi e mengata
Resine ea epoxy e sebetsang ka bongata ke mofuta oa resine ea epoxy e nang le likhato tse tharo kapa tse 'ne tse sebetsang. E na le litšobotsi tsa ho kopanya ho hoholo, ho hanyetsa mocheso hantle, ho fola kapele, matla a phahameng le ho hanyetsa lik'hemik'hale hantle haholo. E sebelisoa haholo masimong a laminate ea koporo ea elektroniki le thepa e kopaneng.
DFE250
DFE254
DFE256
DFE258
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | 'Mala (G) | Hy-Cl (ppm) |
| Resin ea epoxy ea Tetrafiinctional | DFE250 | 195-230 | ≤18 | - |
| Resin epoxy e sebetsang ka bongata e hanelang mocheso o phahameng | DFE254 | 110-120 | <11 | <1000 |
| DFE256 | 90-110 | <11 | <1000 | |
| Resin ea epoxy e sebetsang ka makhetlo a mararo | DFE258 | 155-175 | <18 | <1000 |
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | NV (%) | Ho thibana ha (mPa.s) |
| Tharollo ea resin ea epoxy e sebetsang ka ho feletseng | DFE251 | 200-240 | 70 Setšoantšo sa 1 | 50-250 |
Letoto la resin ea epoxy ea kristale ea kristale ea kristale/mokelikeli
Resin ea epoxy ea kristale (kristale e metsi) e na le litšobotsi tsa ho ba le viscosity e tlase, ho hanyetsa mocheso, ho phalla ho phahameng, coefficient e tlase ea katoloso e otlolohileng le ho monya metsi a tlase, e sebelisoang haholo ho laminate ea koporo ea elektroniki, thepa e kopaneng le masimo a mang.
DFE260
DFE261
DFE262
DFE264
| Lebitso | Nomoro ea Sehlopha | EEW (g/eq) | ntlha ea ho qhibiliha/ho nolofatsa (°C) | Hy-Cl (ppm) | thepa |
| Resin ea epoxy ea Biphenyl phenolic | DFE260 | 280-300 | 65-75 | <300 | Dielectric e tlase, khanyetso e phahameng ea mocheso |
| Resin ea Epoxy ea Biphenyl Liquid Crystalline | DFE261 | 184-192 | >100 | <300 | Viscosity e tlase, conductivity e phahameng ea mocheso |
| Resin ea BHQBiphenyl Crystalline Epoxy | DFE262 | 168-180 | >136 | <300 | Ho teteana ho tlase, ho thibela malakabe |
| Resin ea epoxy ea Tetramethylbisphenol F | DFE264 | 190-210 | >69 | <300 | Viscosity e tlase, dielectric e tlase |
Letoto la Phenol Formaldehyde Resin
Resine ea phenolic e otlolohileng ke resine ea phenolic e ntle le e hloekileng haholo e etselitsoeng indasteri ea thepa ea elektroniki. E khetholloa ka 'mala o bobebe, kabo e tšesaane ea boima ba limolek'hule le tekanyo e tlase ea phenol e lokolohileng (e tlase ka ho fetisisa e ka fokotsoa ho l00ppm). E sebelisoa haholo ho laminate ea koporo ea elektroniki, liphutheloana tsa semiconductor le masimo a mang. Ho phaella moo, ha e ntse e fa bareki lihlahisoa tse itseng tsa ntlha ea ho nolofatsa, k'hamphani ea rona e ka boela ea fana ka tharollo ea resin butanone e nang le dikahare tse tiileng tsa 60% - 70% ho latela tlhoko.
| Lebitso | Nomoro ea Sehlopha | Ponahalo | ho nolofatsa ntlha (°C) | Phenol ea mahala (%) | Dikahare tse sa Fetoheng (%) | e lekanang le hydroxyl (g/eq) |
| Phenol Formaldehyde Resin | DFE308 | Sekoli se bonaletsang se se nang 'mala ho isa ho se mosehla o bobebe | 84 Setšoantšo sa 3 | <0.05 | ≥ 99.5 | 106±2 |
| DFE309 | 95±3 | <0.05 | ≥ 99.5 | 106±2 | ||
| DFE310 DFE311 | 98±3 | ≤0.1 | ≥ 99.5 | 106±3 | ||
| 105 ±3 | ≤0.1 | ≥99.5 | 106±3 | |||
| DFE312 | 115±3 | ≤0.1 | ≥99.5 | 106±3 | ||
| Resin ea phenolic ea mofuta oa BP A | DFE322 | Bofubelu bo bosehla ho isa ho bo sootho | 122 ±3 | ≤0.1 | ≥99.5 | 118±3 |
Letoto la li-resin tsa phenolic tse nang le phosphorus
Resin ea phenolic e nang le phosphorus e na le phosphorus e ngata le ho thibela malakabe hantle, e leng se ka koahelang khaello ea phosphorus e tlase ho resin ea epoxy e nang le phosphorus. E loketse laminate ea koporo ea elektroniki, liphutheloana tsa capacitor, laminate ea motlakase le masimo a mang.
| Lebitso | Nomoro ea Sehlopha | Ponahalo | NV (%) | P% (%) | Ho thibana ha (cps) | e lekanang le hydroxyl (g/eq) | thepa |
| Phosphorus e silafatsang resin ea phenolic | DFE392 | Mokelikeli o mosehla o bonaletsang | 60 ± 1.0 | 8.9〜9.2 | 400—3000 | 360〜400 | Ho lieha ha lelakabe hantle |
| DFE394 | Mokelikeli o mosehla o bonaletsang | 60 ± 1.0 | 8.9〜9.2 | 3000〜5000 | 320〜360 | Mosebetsi o phahameng le ho lieha ha malakabe | |
| DFE395 | Mokelikeli o mosehla o bonaletsang | 56±1,0 | 8.9〜9.2 | 1000〜4000 | 320〜360 | Mosebetsi o phahameng le ho lieha ha malakabe | |
| D992-2 | Bosehla ho isa ho sootho bo bonaletsang | 60 ±1,0 | 8,6 〜8.8 | 400—3000 | 320〜360 | Theko e tlase, e thibelang malakabe hantle | |
| D994 | Mokelikeli o mosehla o bonaletsang | 60 ±1,0 | 8.9〜9.2 | 400〜3000 | 320〜360 | Mosebetsi o phahameng le ho lieha ha malakabe |
Letoto la resin ea hydrocarbon e fetotsoeng
Letoto la resin ea hydrocarbon ke mofuta oa bohlokoa oa resin ea substrate ea potoloho e phahameng tšimong ea 5g. Ka lebaka la sebopeho sa eona se ikhethang sa lik'hemik'hale, hangata e na le dielectric e tlase, khanyetso e ntle ea mocheso le botsitso ba lik'hemik'hale. E sebelisoa haholo-holo ho li-laminate tse koahetsoeng ka koporo tsa 5g, li-laminate, thepa e thibelang malakabe, pente e thibelang mocheso e hanelang mocheso o phahameng, likhomaretsi le thepa ea ho lahla. Lihlahisoa li kenyelletsa resin ea hydrocarbon e fetotsoeng le motsoako oa resin ea hydrocarbon.
Resine ea hydrocarbon e fetotsoeng ke mofuta oa resine ea hydrocarbon e fumanoang ke k'hamphani ea rona ka ho fetola thepa e tala ea hydrocarbon. E na le thepa e ntle ea dielectric, e na le vinyl e ngata, e na le matla a ho hlohlora a phahameng, jj., 'me e sebelisoa haholo linthong tse sebelisoang khafetsa.
| Lebitso | Sehlopha No | Ponahalo | NV (%) | Ho thibana ha (mPa.s) | thepa |
| Resin e fetotsoeng ea styrene butadiene | DFE401 | Mokelikeli o mosehla o bobebe | 35±2.0 | <3000 | Boima bo phahameng ba limolek'hule le dielektri e tlase. E sebelisoa haholo-holo ho resin ea hydrocarbon, polyphenylene ether le sistimi ea resin ea peek |
| Resin ea epoxy e fetotsoeng styrene butadiene resin | DFE402 | Mokelikeli o se nang 'mala ho isa ho o mosehla | 60±2.0 | <5000 | Epoxy e fetotsoeng ke anhydride e nang le thepa e tlase ea dielectric ke e sebelisoang haholo-holo thepa e potlakileng |
| Resin ea styrene butadiene e nang le thepa e tlase ea dielectric | DFE403 | 60±2.0 | <2000 | Dikahare tse phahameng tsa vinyl, bongata bo phahameng ba ho kopanya, tse sebediswang haholo-holo ho resin ya hydrocarbon, polyphenylene ether le sistimi ya resin ya peek | |
| Resin ea hydrocarbon e fetotsoeng | DFE404 | 40+2.0 | <2000 | Dielectric e tlase, ho monya metsi a tlase, matla a ho hlohlora a phahameng | |
| Resin ea polystyrene e fetotsoeng | DFE405 | 60 Setšoantšo sa 2.0 | <3000 | Dikahare tse phahameng tsa vinyl, bongata bo phahameng ba ho kopanya, tse sebediswang haholo-holo ho resin ya hydrocarbon, polyphenylene ether le sistimi ya resin ya peek | |
| Resin ea hydrocarbon e fetotsoeng | DFE406 | 35±2.0 | <2000 | Ho monya metsi a fokolang, matla a ho hlohlora a phahameng, dielectric e betere thepa | |
| resin ea hydrocarbon | DFE412 | Mokelikeli o mosehla o bobebe | 50 Setšoantšo sa 2.0 | <8000 | Modulus e phahameng, boima bo phahameng ba limolek'hule le dielectric e tlase |
| Resin e nang le maqhama a mabeli e nang le thepa e tlase ea dielectric | DFE416 | Mokelikeli o se nang 'mala ho isa ho o mosehla | 60+2.0 | <2000 | Dikahare tse phahameng tsa vinyl, bongata bo phahameng ba ho kopanya, tse sebediswang haholo-holo ho resin ya hydrocarbon, polyphenylene ether le sistimi ya resin ya peek |
Letoto la likarolo tsa resin ea hydrocarbon
Motsoako oa resin ea hydrocarbon ke mofuta oa motsoako oa resin ea hydrocarbon o ntlafalitsoeng ke k'hamphani ea rona bakeng sa puisano ea 5g. Kamora ho qoelisa, ho omisa, ho laminating le ho hatella, motsoako o na le thepa e ntle ea dielectric, matla a ho hlohlora a phahameng, ho hanyetsa mocheso hantle le ho lieha ha malakabe ho hotle. E sebelisoa haholo seteisheneng sa motheo sa 5g, antenna, amplifier ea matla, radar le lisebelisoa tse ling tse nang le maqhubu a phahameng. resin ea carbon e fumanoang ke k'hamphani ea rona ka ho fetola thepa e tala ea hydrocarbon. E na le thepa e ntle ea dielectric, litaba tse ngata tsa vinyl, matla a ho hlohlora a phahameng, jj., 'me e sebelisoa haholo lisebelisoa tse nang le maqhubu a phahameng.
| Lebitso | Nomoro ea Sehlopha | Ponahalo | NV (%) | thepa |
| Sebopeho sa resin ea hydrocarbon | DFE407 | Mokelikeli o mosoeu ho isa ho o mosehla | 65 ±2.0 | Dr/Df： 3.48/0.0037 E sebelisoa haholo-holo ho amplifier ea matla (V0) |
| DFE407A | 65 ±2.0 | Dkt: 3.52 Ho phalla ho hoholo, haholo-holo ho sebelisoang tlhahisong ea sekhomaretsi lakane | ||
| DFE408 | 65 ±2.0 | Dkt/Df： 3.00/0.0027 E sebelisoa haholo seteisheneng sa motheo le antenna (boto ea mekhahlelo e mengata, e thibelang malakabe V0) | ||
| DFE408A | 65 ±2.0 | Dkt: 3.00 Ho phalla ho hoholo, haholo-holo ho sebelisoang tlhahisong ea sekhomaretsi lakane | ||
| DFE409 | 65 ±2.0 | Dkt/Df： 3.30/0.0027 E sebelisoa haholo-holo ka har'a antenna (boto e mahlakore a mabeli, e seng e thibelang malakabe V0) | ||
| DFE410 | 65 ±2.0 | Dkt/Df： 3.40/0.0029 E sebelisoa haholo-holo ka har'a antenna (boto e mahlakore a mabeli, e seng e thibelang malakabe V0) | ||
| DFE411 | 65 Setšoantšo sa 2.0 | Dkt/Df： 3.38/0.0027 E sebelisoa haholo-holo ho amplifier ea motlakase (e seng e thibelang malakabe) |
Ester e sebetsang
Sesebelisoa sa ho phekola sa ester se sebetsang se arabela le resin ea epoxy ho etsa gridi ntle le sehlopha sa bobeli sa hydroxyl ea joala. Sistimi ea ho phekola e na le litšobotsi tsa ho monya metsi a fokolang le ho ba le DD/Df e tlase.
| Lebitso | Nomoro ea Sehlopha | ponahalo | E lekanang le Ester | NV (%) | Viscosity (卬s) | ntlha ea ho nolofatsa rc) |
| Moemeli oa ho phekola ester e sebetsang ka dielectric e tlase | DFE607 | Mokelikeli o sootho bo bobebe o nang le viscous | 230〜240 | 69 ± 1.0 | 1400〜1800 | 140〜150 |
| DFE608 | Mokelikeli o mofubelu o sootho | 275-290 | 69±1.0 Lintho tse tiileng tse fumanehang | 800-1200 | 140-150 | |
| DFE609 | Mokelikeli o sootho | 275-290 | 130-140 | |||
| DFE610 | Mokelikeli o sootho | 275-290 | 100-110 |
Monomer e Ikhethang ea Resin
Dikahare tsa phosphorus di feta 13%, dikahare tsa naetrojene di feta 6%, mme kganyetso ya hydrolysis e ntle haholo. E loketse laminate ya koporo ya elektroniki, diphutheloana tsa capacitor le masimo a mang.
BIS-DOPO ethane ke mofuta oa metsoako ea phosphate ea tlhaho, e thibelang malakabe a tikoloho a se nang halogen. Sehlahisoa sena se tiile ka phofo e tšoeu. Sehlahisoa se na le botsitso bo botle ba mocheso le botsitso ba lik'hemik'hale, 'me mocheso oa ho bola ha mocheso o ka holimo ho 400 °C. Sehlahisoa sena se thibela malakabe hantle haholo ebile se mosa tikolohong. Se ka fihlela litlhoko tsa tikoloho tsa European Union ka botlalo. Se ka sebelisoa e le thibelo ea malakabe tšimong ea laminate e koahetsoeng ka koporo. Ho feta moo, sehlahisoa se lumellana hantle le polyester le nylon, kahoo se na le bokhoni bo botle ba ho potoloha ts'ebetsong ea ho ohla, litšobotsi tse ntle tsa ho ohla le ho taka tse tsoelang pele, 'me se boetse se sebelisoa haholo lefapheng la polyester le nylon.
| Lebitso | Sehlopha No | Ponahalo | ho qhibiliha ntlha (℃) | P% % | N% (%) | Td5% (℃) | Matlo |
| Phosphazene e thibelang lelakabe | DFE790 | Phofo e tšoeu kapa e mosehla e kang ea mobu | 108 ± 4.0 | ≥13 | ≥6 | ≥320 | Dikahare tse phahameng tsa phosphom, e thibelang malakabe, e hanyetsa mocheso o phahameng, e hanyetsa hydrolysis, e loketse laminate e koahetsoeng ka koporo le masimo a mang |
| Lebitso | Sehlopha No | Ponahalo | dikahare % | ho qhibiliha ntlha CC) | P% % | Td2% V | Matlo |
| BIS-DOPO ethane | DFE791 | Phofo e tšoeu | ≥99 | 290-295 | ≥13 | ≥400 | Bongata ba ion ea chloride< 20ppm, ntlha e phahameng ea ho qhibiliha, temperature e phahameng ea ho petsoha, coefficient e tlase ea e^ansion |
Letoto la Maleimide Resin
DFE930n DFE936> DFE937, DFE939^ DFE950 le DFE952 kaofela ke li-resin tsa maleimide tsa maemo a elektroniki tse nang le bohloeki bo phahameng, litšila tse fokolang le ho qhibiliha ho hotle. Ka lebaka la sebopeho sa lesale la imine ka har'a molek'hule, li na le ho tiea ho matla le ho hanyetsa mocheso ho hoholo. Li sebelisoa haholo lisebelisoa tsa sebopeho sa sefofane, likarolo tsa sebopeho tse hanelang mocheso o phahameng oa fiber ea carbon, pente e hanelang mocheso o phahameng, li-laminate, li-laminate tse koahetsoeng ka koporo, polasetiki e bōpiloeng, jj. "Boto ea potoloho e hatisitsoeng ea boemo bo holimo, lisebelisoa tse hanelang ho tsofala, sekhomaretsi sa lebili la daemane, lisebelisoa tsa makenete, likarolo tsa ho lahla le lisebelisoa tse ling tse iunctional le masimo a mang a theknoloji e phahameng.
| Lebitso | NO ea Sehlopha | Ponahalo | Ho qhibiliha ntlha (℃) | Boleng ba Asiti (mg KOH/g) | E feto-fetoha dikahare (%) | (5mm) Ho qhibiliha ha toluene e chesang (metsotso e 5) | Matlo |
| Bismaleimide ea sehlopha sa motlakase | DFE928 | Likaroloana tse tiileng tse mosehla | 158±2 | ≤3.0 | ≤0.3 | E qhibiliha ka botlalo | Ho hanyetsa mocheso o phahameng |
| Diphenylmethane Bismaleimide ea sehlopha sa elektroniki | DFE929 | Likaroloana tse tiileng tse mosehla o bobebe | 162 ± 2 | ≤1.0 | ≤0.3 | Bohloeki bo phahameng le boleng bo tlase ba asiti | |
| Bismaleimide ea sehlopha sa elektroniki | DFE930 | Phofo e tšoeu e mosehla o bobebe | 160 ± 2 | ≤1.0 | ≤0.3 | Bohloeki bo phahameng le asiti e tlase^lue | |
| Bismaleimide e kristale e tlase | DFE936 | 168 ± 2 | ≤1.0 | ≤0.3 | Ho qhibiliha hantle | ||
| Bismaleimide e nang le dielectric e tlase le e nang le dielectric e tlase | DFE937 | 168 ± 2 | ≤1.0 | ≤0.3 | Ho qhibiliha hantle | ||
| Phenyl bismaleimide e nang le ntlha e tlaase ea ho qhibiliha | DFE939 | Phofo e tiileng e sootho kapa e mosehla e sootho e bobebe | Lilemo tse 50 10 | ≤3.0 | ≤0.3 | Ho qhibiliha hantle | |
| Polymaleimide e nang le ntlha e tlaase ea ho qhibiliha | DFE950 | 50 ±10 | ≤3.0 | ≤0.3 | Ho qhibiliha hantle | ||
| Tetramaleirnide e nang le ntlha e tlaase ea ho qhibiliha | DFE952 | 50 ±10 | ≤3.0 | ≤0.3 | Ho qhibiliha hantle |
"Ho ipapisitsoe le 'maraka oa lehae le ho holisa khoebo ea mose ho maoatle" ke leano la rona la nts'etsopele bakeng sa Fektheri ea Chaena bakeng sa Chaena CNMI Epoxy Resin kristale e hlakileng bakeng sa ho penta tafole e nyane ea mabenyane ea ho betla mabenyane a matsoho a tafole ea noka, U ka fumana theko e tlase haholo mona. Hape u tla fumana lintho tsa boleng bo holimo le lits'ebeletso tse ntle mona! Ka kopo le ka mohla u se ke ua emela ho re fumana!
Feme ea Chaena bakeng saResin ea Epoxy ea Chaena, resin ea epoxy e se nang chefo, Ka molao-motheo oa ho hapa bohle, re tšepa ho u thusa ho etsa phaello e ngata 'marakeng. Monyetla ha se oa ho tšoaroa, empa oa ho hlahisoa. Lik'hamphani life kapa life tsa khoebo kapa barekisi ba tsoang linaheng life kapa life baa amoheloa.
