Mofani oa Lefatše oa Tšireletso ea Tikoloho
Le Safety New Material Solutions
China Factory for China CNMI Epoxy Resin kristale e hlakileng bakeng sa ho roala tafoleng e nyane ea noka mabenyane a mesebetsi ea matsoho mabenyane a terei lebopo
"E ipapisitse le 'maraka oa lehae le ho holisa khoebo ea mose ho maoatle" ke leano la rona la nts'etsopele bakeng sa fektheri ea China bakeng sa China CNMI Epoxy Resin crystal clear bakeng sa ho roala mabenyane a mabenyane a tafoleng ea noka ea mabenyane a mabenyane lebopong la mabenyane, U ka fumana theko e tlase haholo mona. Hape o tla fumana lintho tsa boleng bo holimo le lits'ebeletso tse ntle mona! Ka kopo le ka mohla u se ke ua emela hore u re tšoare!
"E ipapisitse le 'maraka oa lehae le ho atolosa khoebo ea mose ho maoatle" ke leano la rona la nts'etsopele eaChina Epoxy resin, resin e se nang chefo ea epoxy, Ka molao-motheo oa win-win, re tšepa ho u thusa ho etsa phaello e ngata 'marakeng. Monyetla ha se oa ho ts'oaroa, empa ke ho boptjoa. Lik'hamphani life kapa life tsa khoebo kapa barekisi ba tsoang linaheng life kapa life lia amoheloa.
Lisebelisoa tsa Litšoantšo
Benzoxazines Resin
Letoto le tlase la DK Benzoxazine Resin
Bisphenol Letoto la epoxy resin
Bisphenol F epoxy resin letoto
Phenolic epoxy resin letoto
Phosphorus e nang le letoto la epoxy resin
Brominated epoxy resin letoto
MDI e fetotsoeng letoto la epoxy resin
Letoto la macromolecular epoxy resin
DCPD epoxy resin letoto
Multifunctional epoxy resin letoto
Crystalline/liquid crystal epoxy resin letoto
Phenol Formaldehyde Resin letoto
Phosphorus e nang le letoto la phenolic resin
Letoto la resin ea hydrocarbon e fetotsoeng
Letoto la ho hlophisoa ha resin ea hydrocarbon
Ester ea mafolofolo
Monomer e khethehileng ea Resin
Letoto la Maleimide Resin
Benzoxazines Resin
Khampani ea rona ke k'hamphani ea pele ea ho hlokomela tlhahiso e kholo ea indasteri ea Benzoxazine Resin Chaena, 'me e boemong bo ka sehloohong lefapheng la tlhahiso, kopo le lipatlisiso tsa Benzoxazine Resin. Lihlahisoa tsa Benzoxazine Resin tsa k'hamphani ea rona li fetisitse ho fumanoa ha SGS, 'me ha li na halogen le RoHS (Pb, CD, Hg, Gr (VI), PBBs, PBDEs) lintho tse kotsi. Tšobotsi ke hore ha ho na molek'hule e nyenyane e lokolloa nakong ea ho folisa 'me molumo o batla o fokotseha ka zero; Lihlahisoa tse folisang li na le litšobotsi tsa ho monya metsi a tlase, matla a tlase a holim'a metsi, ho hanyetsa mocheso o motle oa UV, ho hanyetsa mocheso o phahameng, carbon e setseng, ha ho na tlhoko ea catalysis e matla ea acid le curing.lt e sebelisoang haholo ho li-laminates tsa koporo tsa elektroniki, li-laminate, lisebelisoa tse kopantsoeng, lisebelisoa tsa sefofane, lisebelisoa tsa likhohlano le masimo a mang.
| Lebitso | Kereiti No | Ponahalo | nolofatsa ntlha (°C) | Mahala Phenol (%) | GT (s @210℃) | Viscosity | NV (%) | thepa |
| Mofuta oa MDA oa Benzoxazine | DFE125 | Mokelikeli o bosootho bo bofubelu bo bonaletsang | - | ≤5 | 100-230 | 30-70 (s,4# 杯) | 70±3 | Tg e phahameng, ho hanyetsa mocheso o phahameng, ho thibela lelakabe le se nang halogen, matla a phahameng le ho tiea |
| Mofuta oa BPA Benzoxazine | DFE127 | Mokelikeli o mosehla o bonaletsang | - | ≤5 | 1100-1600 | 200-800 Mpa·s | Libeke tse 80 2 | Modulus e phahameng, ho hanyetsa mocheso o phahameng, ho thibela lelakabe le se nang halogen, ho monya metsi a tlase |
| Mofuta oa BPA Benzoxazine | DFE127A | Bosehla bo tiileng | 60-85 | ≤5 | 500-800 | - | 98±1,5 | Modulus e phahameng, ho hanyetsa mocheso o phahameng, ho thibela lelakabe le se nang halogen, ho monya metsi a tlase |
| Mofuta oa BPF Benzoxazine | DFE128 | Mokelikeli o bosootho bo bofubelu bo bonaletsang | - | ≤5 | 350-400 | 30-100 (s,4# 杯) | 75±2 | Matla a matle, ho hanyetsa mocheso o phahameng, ho thibela lelakabe le se nang halogen, ho monya metsi a tlase le viscosity e tlase. |
| Mofuta oa ODA oa Benzoxazine | DFE129 | Brownish khubelu e bonaletsang | - | ≤2 | 120-500 | <2000 mpa.s | Libeke tse 65 3 | Tg: 212°C, PlienoK≤ 2% ea Mahala, Dk: 2.92, Df:0.0051 |
Letoto le tlase la DK Benzoxazine Resin
Benzoxazine Resin e tlaase ea dielectric ke mofuta oa Benzoxazine Resin e entsoeng bakeng sa maqhubu a phahameng le lebelo le phahameng la koporo e apereng laminate. Mofuta ona oa resin o na le litšobotsi tsa Dk / DF tse tlase le ho hanyetsa mocheso o phahameng. E sebelisoa haholo M2, M4 grade copper clad laminate kapa HDI board, multilayer board, composite materials, friction materials, aerospace thepa le masimo a mang.
| Lebitso | Kereiti No | Ponahalo | nolofatsa ntlha rc> | Mahala Phenol (%) | GT (s @210℃) | Viscosity | NV (%) | thepa |
| Benzoxazine ea dielectric e tlase | DFE130 | E 'mala o mosehla oa granular kapa o tiileng haholo | 55-80 | ≤5 | 400-600 | - | ≥98.5 | Dk: 2.75, Tg:196℃: |
| Pheliso e potlakileng ea benzoxazine mocheso o mahareng le o tlase | DFE146 | Seedi se bosootho bo mosehla bo bonaletsang | - | ≤5 | 100-130 | <200 (s,4# 杯) | 75±2 | Dk: 3.04, Df: 0.0039 Lebelo le phahameng la ho folisa, Tg e phahameng le dielectric tse tlase |
| Benzoxazine e nang le bond e habeli | DFE148 | Mokelikeli o bosootho bo bofubelu bo bonaletsang | - | ≤5 | Nnete tekanyo | <2000 Mpa·s | 80±2 | E ka sebetsana le li-resin tse ling tse nang le bond e habeli |
| Ketane e kholo ea benzoxazine | DFE149 | Seedi se bosootho bo mosehla bo bonaletsang | - | ≤3 | 80-160 | <2000 Mpa·s | 70 meqolo 2 | Tg: 215#C, Td5%: 380°C, Dk: 2.87, Df:0.0074 (10GHz) |
| DCPD mofuta Benzoxazine | DFE150 | Seedi se bofubedu bo sootho bo bonaletsang | - | ≤3 | 2000-2500 | <1000 Mpa·s | 75±2 | Dk: 2.85, Df: 0.0073 (10GHz) |
| Bisphenol benzoxazine | DFE153 | Seedi se bosootho bo mosehla bo bonaletsang | 一 | ≤3 | 100-200 | <2000 Mpa·s | 70±2 | Dk: 2.88, Df: 0.0076 (10GHz), |
Bisphenol Letoto la epoxy resin
Bisphenol Resin ea epoxy ea k'hamphani ea rona e kenyelletsa metsi a epoxy resin, epoxy resin e tiileng le solvent epoxy resin, e nang le hydrolysis chlorine e tlase mme e sebelisoa haholo ho koahela, lisebelisoa tsa elektroniki, lisebelisoa tse kopaneng le likarolo tse ling.
| Lebitso | Kereiti No | EEW (g/eq) | Mmala (G) | Viscosity (mPa.s) | Hy-Cl (ppm) |
| Liquid bisphenol A epoxy resin | DFE1126 | 165-175 | ≤0.5 | 3000-5000 | <200 |
| DFE1127 | 180-190 | ≤1 | 8000-11000 | <500 | |
| DFE1128 | 184-194 | ≤1 | 12000-15000 | <500 | |
| DFE1128H | 184-194 | ≤1 | 12000-15000 | <100 | |
| Lebitso | Kereiti No | EEW(g/eq) | Mmala (G) | Sebaka sa ho nolofatsa (℃) | |
| Solid bisphenol Resin ea epoxy | DFE1011 | 450-500 | ≤1 | 60-70 | |
| DFE1901 | 450-500 | ≤1 | 65-75 | ||
| Lebitso | Kereiti No | EEW (g/eq) | Mmala (G) | Viscosity (mPa.s) | NV (%) |
| Tharollo mofuta oa metsi bisphenol A epoxy resin | DFE1901EK70 | 450-500 | ≤1 | 2000-5000 | 70±1 |
Bisphenol F epoxy resin letoto
Bisphenol F epoxy resin e na le litšobotsi tsa viscosity e tlase, metsi a matle le ho koloba, 'me k'hamphani ea rona e na le theknoloji e ikemetseng ea tlhahiso ea bisphenol F e nang le lisebelisoa tse lekaneng tse tala. Lihlahisoa li sebelisoa haholo ho lira tse se nang solvent, ho lahla, likhomaretsi, lisebelisoa tsa ho kenya letsoho le masimo a mang.
| Lebitso | Kereiti No | EEW (g/eq) | Viscosity (mPa·s) | Mmala (G) | Hy-Cl (ppm) |
| Mokelikeli oa bisphenol F epoxy resin | DFE1160 | 155-165 | ≤1600 | ≤1 | ≤100 |
| DFE1170L | 165-175 | 2900-3500 | ≤1 | ≤100 | |
| DFE1170 | 165-175 | 3500-4500 | ≤1 | ≤100 | |
| DFE1170H | 165-175 | 5000-6000 | ≤1 | ≤100 | |
| DFE1170K | 165-175 | 5000-6000 | ≤1 | ≤200 | |
| Lebitso | Kereiti No | EEW (g/eq) | Mmala (G) | Sebaka sa ho nolofatsa (℃) | |
| Resin e tiileng ea bisphenol F epoxy | DFE1701 | 450-500 | ≤1 | 45-55 | |
| DFE1702 | 600-700 | ≤1 | 75-85 | ||
| DFE1703 | 700-800 | ≤1 | 85-95 | ||
| DFE1704D | 900-1000 | ≤1 | 90-100 | ||
| DFE1707D | 1300-1700 | ≤1 | 100-110 | ||
Phenolic epoxy resin letoto
Li-resin tsa rona tsa phenolic epoxy li kenyelletsa mofuta oa PNE, mofuta oa BNE le mofuta oa CNE. Lihlahisoa tsa bona tse phekotsoeng li na le matla a mangata a ho kopanya, matla a matle a ho kopanya, ho hanyetsa mocheso le ho hanyetsa lik'hemik'hale. Li sebelisoa haholo ho li-laminate tsa koporo tsa elektronike, li-laminate tsa elektronike, li-adhesive tse thibelang mocheso, li-composites, liphahlo tse nang le mocheso o phahameng, boenjiniere ba sechaba le li-inks tsa elektronike.
| Lebitso | Kereiti No | EEW (g/eq) | ntlha e nolofatsang (°C) | Mmala (G) | Hy-Cl (ppm) |
| PNE mofuta oa phenolic epoxy resin | DFE1638 | 171-180 | 36-40 | ≤0.5 | ≤200 |
| DFE1638S | 171-179 | 36-40 | ≤0.5 | ≤200 | |
| DFE1636 | 170-178 | 27-31 | <1 | <300 | |
| DFE1637 | 170-178 | 31-36 | <1 | <300 | |
| DFE1639 | 174-180 | 44-50 | <1 | <300 | |
| DFE1625 | 168-178 | 9000-13000mpa·s | ≤1 | <300 | |
| Mofuta oa BNE phenolic epoxy resin | DFE1200 | 200-220 | 60-70 | <3 | <500 |
| DFE1200H | 205-225 | 70-80 | <3 | <500 | |
| DFE1200HH | 210-230 | 80-90 | <3 | <500 | |
| CNE mofuta oa phenolic epoxy resin | DFE1701 | 196-206 | 65-70 | <2 | <500 |
| DFE1702 | 197-207 | 70-76 | <2 | <500 | |
| DFE1704 | 200-215 | 88-93 | <2 | <1000 | |
| DFE1704M | 200-215 | 83-88 | <2 | <1000 | |
| Lethathamo la DFE1704ML | 200-210 | 80-85 | <2 | <1000 | |
| DFE1704L | 207-215 | 78-83 | <2 | <1000 | |
| Lebitso | Kereiti No | EEW (g/eq) | Viscosity (mPa.s) | NV (%) | |
| Tharollo mofuta oa phenolic epoxy resin | DFE236 | 200-220 | 1000-4000 | 80±1 | |
| DFE238 | 170-190 | 200-500 | Libeke tse 80 1 | ||
Phosphorus e nang le letoto la epoxy resin
Li-epoxy resin tse nang le phosphorus haholo-holo li kenyelletsa mefuta e meraro, e leng mofuta oa DOPO, DOPO-HQtype le DOPO-NQtype. Li khabane ka ho lieha ha lelakabe le ho hanyetsa mocheso, 'me li na le metsi a fokolang a ho monya le ho atolosa coefficient.They ke tsa halogen-free flame retardant epoxy resin,' me li lumellana le RoHS le WEEE Directive.Li sebelisoa haholo-holo ka har'a halogen-free flame retardant printed circuit board, electronic copper clad field laminate, other electronic copper clad field laminate.
| Lebitso | Kereiti No | Ponahalo | NV (%) | EEW (g/eq) | Viscosity (mPa.s) | P% (%) |
| DOPO-HQ e fetotsoeng phenolic epoxy resin | DFE200 | Seedi se bofubedu bo sootho bo bonaletsang | 70±1.0 | 320 ±20 | <1000 | 2.0±0.1 |
| DOPO-HQ e fetotsoeng phenolic epoxy resin | DFE200A | Seedi se bofubedu bo sootho bo bonaletsang | 70±1.0 | 275 ±25 | <1000 | 1.0±0.1 |
| DOPO-HQ e fetotsoeng phenolic epoxy resin | DFE200C | Mokelikeli o mosehla o bonaletsang | 80±1.0 | 255 ±15 | 1000-7000 | 2.0±0.1 |
| DOPO-HQ e fetotsoeng phenolic epoxy resin | DFE200D | Mokelikeli o mosehla o bonaletsang | 80±1.0 | 230±20 | 1000-4000 | 1.0±0.1 |
| DOPO-NQ e fetotsoeng ka phenolic epoxy resin | DFE201 | Seedi se bofubedu bo sootho bo bonaletsang | 75±1.0 | 330±30 | 1000-3000 | 2.5 ±0.1 |
| DOPO-NQ e fetotsoeng ka phenolic epoxy resin | DFE201A | Seedi se bofubedu bo sootho bo bonaletsang | 75±1.0 | 330 likhato tse 10 | 1500-1700 | 2.5 ±0.1 |
| DOPO e fetotsoeng ka phenolic epoxy resin | DFE202 | Mokelikeli o bonaletsang o se nang mmala ho isa ho o mosehla o kganyang | 75 ±1.0 | 315±20 | 1000-3000 | 3.1 〜3.2 |
| DOPO e fetotsoeng ka phenolic epoxy resin | DFE202A | Seedi se bofubedu bo sootho bo bonaletsang | 70 ±1.0 | 300±20 | <2000 | 2.4±0.1 |
| DOPO e fetotsoeng ka phenolic epoxy resin | DFE202B | Mokelikeli o bonaletsang o se nang mmala ho isa ho o mosehla o kganyang | 75±1.0 | 310±20 | ≤3000 | 2.8 〜3.2 |
| DOPO e fetotsoeng ka phenolic epoxy resin | DFE202C | Mokelikeli o hloekileng le o bonaletsang | 75±1.0 | 300±20 | <3000 | 3.1 ±0.1 |
| DOPO e fetotsoeng ka phenolic epoxy resin | DFE202D | Mokelikeli o mosehla o bonaletsang | 70±1.0 | 360 lik'hilograma tse 30 | ≤ 1500 | 2.5 ±0.2 |
Brominated epoxy resin letoto
Brominated epoxy resins ke mofuta oa halogen flame retardant epoxy resin. Khamphani ea rona e hlahisa li-bromine tse ngata le li-bromine tse tlase tsa epoxy resin, tse khonang ho kenella hantle lesela la khalase, tse thibelang lelakabe le lecha le ho hanyetsa mocheso, 'me li sebelisoa haholo tšimong ea laminate e sa halogen ea lelakabe le nang le malakabe a koporo.
| Lebitso | Kereiti No | Ponahalo | NV (%) | EEW (g/eq) | Viscosity (mPa.s) | Br% (%) |
| litaba tse tlase tsa bromine epoxy resin | DFE271 | Seedi se bosehla bo sootho ho isa bokgubedu bo bosootho bo bonaletsang | 80±1.0 | 250-280 | 200-800 | 11.5±1.0 |
| DFE274 | Seedi se bosehla bo sootho ho isa bokgubedu bo bosootho bo bonaletsang | 75±1.0 | 280-320 | 200-1500 | 18-21 | |
| DFE276 | Seedi se bosehla bo sootho ho isa bokgubedu bo bosootho bo bonaletsang | 75 Setšoantšo sa 1.0 | 340-380 | 200-400 | 18-21 | |
| DFE277 | Seedi se bosehla bo sootho ho isa bokgubedu bo bosootho bo bonaletsang | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| DFE278 | Seedi se bofubedu bo sootho bo bonaletsang | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| Lebitso | Kereiti No | Ponahalo | EEW (g/eq) | nolofatsa ntlha (°C) | Br% (%) | |
| litaba tse phahameng tsa bromine epoxy resin | DFE270 | E se nang mmala ho isa bosehla bo tiileng | 380-420 | 67-74 | 46-50 | |
MDI e fetotsoeng letoto la epoxy resin
MDI e fetotsoeng epoxy resin ke Isocyanate e fetotsoeng epoxy e nang le oxazolidinone e kenngoeng ketane e kholo, e nang le ho hanyetsa mocheso o babatsehang le ho fetoha habonolo. Sehlahisoa se fumaneha ka Boron ntle le Boron e nang le, E qhibiliha ka har'a li-solvents tse tloaelehileng tse kang propylene glycol methyl ether, acetone, butanone, joalo-joalo. E na le ho lumellana hantle le dicyandiamide, phenolic phenolic agent, 'me e loketse tšimo ea halogen e se nang lead-free copper clad laminate.
| Lebitso | Kereiti No | Ponahalo | NV (%) | EEW (g/eq) | Viscosity (mPa.s) | Br% (%) |
| MDI e fetotsoe resin ea epoxy ea brominated | DFE204 | Seedi se bofubedu bo sootho bo bonaletsang | 75±1.0 | 330-370 | 500-2000 | 16.5-18 |
| DFE204A | Seedi se bofubedu bo sootho bo bonaletsang | 75±1.0 | 330-370 | 500-2000 | 16.5-18 | |
| MDI e fetotsoeng epoxy resin | DFE205 | Mokelikeli o mosehla o sootho o bonaletsang | 75 ±1.0 | 250-310 | 500-2500 | - |
| DFE205A | Mokelikeli o mosehla o sootho o bonaletsang | 75 ±1.0 | 270-330 | 500-2500 | - |
Letoto la macromolecular epoxy resin
Macromolecular epoxy resins ke mofuta oa li-resin tsa epoxy tse fetotsoeng tsa bisphenol A / F, tse nang le marapo a limolek'hule a tenyetsehang le likarolo tse telele tsa ketane ea molek'hule, 'me li na le ho feto-fetoha ha maemo le ho khomarela. Li loketse boto ea potoloho e hatisitsoeng, laminate ea koporo ea elektronike, sekhomaretsi, lisebelisoa tse kopantsoeng, laminate ea motlakase le lihlahisoa tse ling.
| Lebitso | Kereiti No | Ponahalo | NV (%) | EEW (g/eq) | Viscosity (mPa.s) |
| Bisphenol e fetotsoeng Resin ea epoxy | DFE206 | Mokelikeli o bonaletsang o se nang mmala ho isa ho o mosehla o kganyang | 75 Setšoantšo sa 1.0 | 470±30 | 500-3000 |
| Resin e fetotsoeng ea bisphenol Fepoxy | DFE207 | Seedi se bonaletsang se bosehla bo kganyang ho isa bofubedung bo sootho | 70±1.0 | 550 ±50 | 500-3000 |
DCPD epoxy resin letoto
DCPD epoxy resin ke mofuta oa linear multifunctional epoxy resin e nang le Dk / DF e tlase, e hanyetsa mocheso o matla, mongobo o tlase, ho khomarela haholo le ho hanyetsa lik'hemik'hale. E sebelisoa haholo maqhubu a phahameng le lebelo le phahameng la koporo e apereng laminate, lisebelisoa tsa ho bopa, liphahlo tse thibelang lelakabe, likhomaretsi tse thibelang mollo le masimo a mang.
| Lebitso | Kereiti No | EEW (g/eq) | ntlha e nolofatsang (°C) | Hy-Cl (ppm) |
| Resin e tiileng ea DCPD epoxy | Tlhaloso: DFE211LL | 260-275 | 53-60 | <300 |
| DFE211L | 265-275 | 60-70 | <300 | |
| DFE211 | 260-280 | 70-80 | <300 | |
| DFE211H | 260-280 | 80-90 | <300 | |
| DFE211HH | 265-285 | 90-100 | <300 | |
| Lebitso | Kereiti No | EEW (g/eq) | NV (%) | Viscosity (mPa.s) |
| DCPD epoxy resin tharollo | DFE210 | 260-280 | 75±1 | 200-800 |
Multifunctional epoxy resin letoto
Multifunctional epoxy resin ke mofuta oa epoxy resin e nang le likhato tse tharo kapa tse 'ne tse sebetsang. E na le litšoaneleho tsa matla a mangata a ho kopanya li-cross-link, ho hanyetsa mocheso o motle, ho phekola ka potlako, matla a phahameng le khanyetso e babatsehang ea lik'hemik'hale. E sebelisoa haholo masimong a laminate ea koporo ea elektronike le lisebelisoa tse kopantsoeng.
DFE250
DFE254
DFE256
DFE258
| Lebitso | Kereiti No | EEW (g/eq) | Mmala (G) | Hy-Cl (ppm) |
| Tetrafiinctional epoxy resin | DFE250 | 195-230 | ≤18 | - |
| Mocheso o phahameng o hanyetsanang le li-multifunctional epoxy resin | DFE254 | 110-120 | <11 | <1000 |
| DFE256 | 90-110 | <11 | <1000 | |
| Resin ea epoxy e sebetsang ka makhetlo a mararo | DFE258 | 155-175 | <18 | <1000 |
| Lebitso | Kereiti No | EEW (g/eq) | NV (%) | Viscosity (mPa.s) |
| Tetrafunctional epoxy resin tharollo | DFE251 | 200-240 | 70 Setšoantšo sa 1 | 50-250 |
Crystalline/liquid crystal epoxy resin letoto
Crystalline (liquid crystal) epoxy resin e na le litšoaneleho tsa viscosity e tlase, ho hanyetsa mocheso, metsi a mangata, coefficient e tlase ea katoloso ea mela le ho monya metsi a tlase, e sebelisoang haholo ho laminate ea koporo ea elektroniki, lisebelisoa tse kopaneng le masimo a mang.
DFE260
DFE261
DFE262
DFE264
| Lebitso | Kereiti No | EEW (g/eq) | qhibidihisoa (//) /softening point (°C) | Hy-Cl (ppm) | thepa |
| Biphenyl phenolic epoxy resin | DFE260 | 280-300 | 65-75 | <300 | Dielectric e tlase, ho hanyetsa mocheso o phahameng |
| Biphenyl Liquid Crystalline Epoxy resin | DFE261 | 184-192 | >100 | <300 | Viscosity e tlase, conductivity e phahameng ea mocheso |
| BHQBiphenyl Crystalline Epoxy resin | DFE262 | 168-180 | >136 | <300 | Viscosity e tlase, e thibelang malakabe |
| Tetramethylbisphenol F epoxy resin | DFE264 | 190-210 | > 69 | <300 | Viscosity e tlase, dielectric e tlase |
Phenol Formaldehyde Resin letoto
Linear phenolic resin ke resin e ntle le e hloekileng ea phenolic e ntlafalitsoeng bakeng sa indasteri ea lisebelisoa tsa elektroniki. E khetholloa ka 'mala o bobebe, kabo ea boima ba molek'hule e fokolang le lintho tse tlaase tsa phenol (tse tlaase ka ho fetisisa li ka fokotsoa ho l00ppm). E sebelisoa haholo ho laminate ea koporo ea elektroniki, liphutheloana tsa semiconductor le masimo a mang. Ntle le moo, ha re ntse re fa bareki lihlahisoa tse khethehileng tsa ho nolofatsa, k'hamphani ea rona e ka fana ka tharollo ea resin butanone e nang le litaba tse tiileng tsa 60% - 70% ho latela tlhoko.
| Lebitso | Kereiti No | Ponahalo | nolofatsa ntlha (°C) | Phenol ea Mahala (%) | Litaba tse sa Feleng (%) | hydroxyl e lekanang (g/eq) |
| Phenol Formaldehyde Resin | DFE308 | Se tiileng ho isa ho sesehla se kganyang se bonaletsang | 84 Setšoantšo sa 3 | <0.05 | ≥ 99.5 | 106±2 |
| DFE309 | 95±3 | <0.05 | ≥ 99.5 | 106±2 | ||
| DFE310 DFE311 | 98±3 | ≤0.1 | ≥ 99.5 | 106±3 | ||
| 105 ±3 | ≤0.1 | ≥99.5 | 106±3 | |||
| DFE312 | 115±3 | ≤0.1 | ≥99.5 | 106±3 | ||
| BP A mofuta oa phenolic resin | DFE322 | Bosehla ho isa ho bosootho bo bofubedu bo tiileng | 122 ±3 | ≤0.1 | ≥99.5 | 118±3 |
Phosphorus e nang le letoto la phenolic resin
Phosphorus e nang le phenolic resin e na le phosphorus e ngata le ho lieha ho hoholo ha lelakabe, e leng se ka etsang hore ho be le khaello ea phosphorus e fokolang ea phosphorus e nang le epoxy resin. E loketse bakeng sa laminate ea koporo ea elektronike, liphutheloana tsa capacitor, laminate ea motlakase le masimo a mang.
| Lebitso | Kereiti No | Ponahalo | NV (%) | P% (%) | Viscosity (cps) | hydroxyl e lekanang (g/eq) | thepa |
| Phosphorus e silafatsa phenolic resin | DFE392 | Mokelikeli o mosehla o bonaletsang | 60 ±1.0 | 8.9 〜9.2 | 400-3000 | 360〜400 | Ho lieha ho hotle ha lelakabe |
| DFE394 | Mokelikeli o mosehla o bonaletsang | 60 ±1.0 | 8.9 〜9.2 | 3000〜5000 | 320〜360 | Ts'ebetso e phahameng le ho lieha ha lelakabe | |
| DFE395 | Mokelikeli o mosehla o bonaletsang | 56±1,0 | 8.9 〜9.2 | 1000〜4000 | 320〜360 | Ts'ebetso e phahameng le ho lieha ha lelakabe | |
| D992-2 | Bosehla ho isa bosootho bo bonaletsang | 60 ±1,0 | 8,6 le 8.8 | 400-3000 | 320〜360 | Theko e tlase, e thibelang mollo hantle | |
| D994 | Mokelikeli o mosehla o bonaletsang | 60 ±1,0 | 8.9 〜9.2 | 400〜3000 | 320〜360 | Ts'ebetso e phahameng le ho lieha ha lelakabe |
Letoto la resin ea hydrocarbon e fetotsoeng
Letoto la resin ea Hydrocarbon ke mofuta oa bohlokoa oa resin e phahameng ea maqhubu a potoloho sebakeng sa 5g. Ka lebaka la sebopeho sa eona se khethehileng sa lik'hemik'hale, ka kakaretso se na le dielectric e tlaase, ho hanyetsa mocheso o babatsehang le botsitso ba lik'hemik'hale. E sebelisoa haholo-holo ka 5g copper clad laminates, laminates, lintho tse thibelang malakabe, pente e thibelang mocheso o phahameng, sekhomaretsi le lisebelisoa tsa ho lahlela. Lihlahisoa li kenyelletsa resin ea hydrocarbon e fetotsoeng le sebopeho sa resin ea hydrocarbon.
Resin ea hydrocarbon e fetotsoeng ke mofuta oa resin ea hydrocarbon e fumanoang ke k'hamphani ea rona ka ho fetola lisebelisoa tse tala tsa hydrocarbon. E na le thepa e ntle ea dielectric, litaba tse phahameng tsa vinyl, matla a phahameng a peel, joalo-joalo, 'me e sebelisoa haholo lisebelisoa tse phahameng tsa maqhubu.
| Lebitso | Kereiti No | Ponahalo | NV (%) | Viscosity (mPa.s) | thepa |
| Resin ea styrene butadiene e fetotsoeng | DFE401 | Mokelikeli o mosehla o kganyang | 35±2.0 | <3000 | Boima bo phahameng ba molek'hule le dielectric e tlase. E sebelisoa haholo ho hydrocarbon resin, polyphenylene ether le peek resin system |
| Resin ea epoxy e fetotsoe resin ea styrene butadiene | DFE402 | Seedi se se nang mmala ho isa ho bosehla | 60±2.0 | <5000 | Anhydride e fetotsoeng epoxy e nang le thepa e tlase ea dielectric ke e sebedisoang haholo disebedisweng tsa lebelo le phahameng |
| Resin ea styrene butadiene e nang le thepa e tlase ea dielectric | DFE403 | 60±2.0 | <2000 | Likahare tse phahameng tsa vinyl, li-high crosslinking density, tse sebelisoang haholo ho resin ea hydrocarbon, polyphenylene ether le peek resin system. | |
| Resin ea hydrocarbon e fetotsoeng | DFE404 | 40+2.0 | <2000 | Dielectric e tlase, ho monya metsi a tlase, matla a lekhapetla le phahameng | |
| Resin ea polystyrene e fetotsoeng | DFE405 | 60 Setšoantšo sa 2.0 | <3000 | Likahare tse phahameng tsa vinyl, li-high crosslinking density, tse sebelisoang haholo ho resin ea hydrocarbon, polyphenylene ether le peek resin system. | |
| Resin ea hydrocarbon e fetotsoeng | DFE406 | 35±2.0 | <2000 | Ho monya metsi a tlase, matla a lekhapetla le phahameng, dielectric e betere thepa | |
| resin ea hydrocarbon | DFE412 | Mokelikeli o mosehla o kganyang | 50 Setšoantšo sa 2.0 | <8000 | Modulus e phahameng, boima bo phahameng ba limolek'hule le dielectric e tlase |
| Resin ea bond e habeli e nang le thepa e tlase ea dielectric | DFE416 | Seedi se se nang mmala ho isa ho bosehla | 60+2.0 | <2000 | Likahare tse phahameng tsa vinyl, li-high crosslinking density, tse sebelisoang haholo ho resin ea hydrocarbon, polyphenylene ether le peek resin system. |
Letoto la ho hlophisoa ha resin ea hydrocarbon
Hydrocarbon resin composite ke mofuta oa motsoako oa hydrocarbon resin o ntlafalitsoeng ke k'hamphani ea rona bakeng sa puisano ea 5g. Ka mor'a ho qoelisoa, ho omisa, laminating le ho hatella, motsoako o na le thepa e ntle ea dielectric, matla a phahameng a peel, ho hanyetsa mocheso o motle le ho thibela mollo o motle. E sebelisoa haholo seteisheneng sa 5g, antenna, amplifier ea matla, radar le lisebelisoa tse ling tse nang le maqhubu a phahameng. E na le thepa e ntle ea dielectric, litaba tse phahameng tsa vinyl, matla a phahameng a peel, joalo-joalo, 'me e sebelisoa haholo lisebelisoa tse phahameng tsa maqhubu.
| Lebitso | Kereiti No | Ponahalo | NV (%) | thepa |
| Sebopeho sa resin ea hydrocarbon | DFE407 | Mokelikeli o mosoeu ho isa ho o mosehla | 65 ±2.0 | Dk/Df: 3.48/0.0037 E sebelisoa haholo ho amplifier ea matla (V0) |
| DFE407A | 65 ±2.0 | Dk: 3.52 High fluidity, haholo-holo e sebelisoang ho hlahisa sekhomaretsi letlapa | ||
| DFE408 | 65 ±2.0 | Dk/Df: 3.00/0.0027 E sebelisoa haholo setsing sa setsi le antenna (boto ea multilayer, lelakabe la mollo V0) | ||
| DFE408A | 65 ±2.0 | Dk: 3.00 High fluidity, haholo-holo e sebelisoang ho hlahisa sekhomaretsi letlapa | ||
| DFE409 | 65 ±2.0 | Dk/Df: 3.30/0.0027 E sebelisoa haholo ho antenna (boto e mahlakoreng a mabeli, V0 e sa chesehang mollo) | ||
| DFE410 | 65 ±2.0 | Dk/Df: 3.40/0.0029 E sebelisoa haholo ho antenna (boto e mahlakoreng a mabeli, V0 e sa chesehang mollo) | ||
| DFE411 | 65 Setšoantšo sa 2.0 | Dk/Df: 3.38/0.0027 Haholo-holo e sebelisoa ho amplifier ea matla (e sa retang mollo) |
Ester ea mafolofolo
Sehlahisoa se sebetsang sa ester se sebetsa ka epoxy resin ho theha grid ntle le sehlopha sa bobeli sa joala sa hydroxyl. Sistimi ea pheko e na le litšobotsi tsa ho monya metsi a tlase le Dk / Df e tlase.
| Lebitso | Kereiti No | ponahalo | Ester e lekanang | NV (%) | Viscosity (卬s) | ntlha e nolofatsang rc) |
| Moemeli oa pheko oa ester o tlase oa dielectric | DFE607 | Mokelikeli o mosootho o kganyang wa viscous | 230〜240 | 69 ±1.0 | 1400〜1800 | 140〜150 |
| DFE608 | Mokelikeli o mofubelu o bosootho | 275-290 | 69±1.0 Lintho tse tiileng tse fumanehang | 800-1200 | 140-150 | |
| DFE609 | Mokelikeli o sootho | 275-290 | 130-140 | |||
| DFE610 | Mokelikeli o sootho | 275-290 | 100-110 |
Monomer e khethehileng ea Resin
Likahare tsa phosphorus li feta 13%, litaba tsa naetrojene li feta 6%, 'me ho hanyetsa hydrolysis ho molemo haholo. E loketse bakeng sa laminate ea koporo ea elektronike, liphutheloana tsa capacitor le masimo a mang.
BIS-DOPO ethane ke mofuta oa metsoako ea phosphate organic, e thibelang malakabe a tikoloho e se nang halogen. Sehlahisoa ke phofo e tšoeu e tiileng. Sehlahisoa se na le botsitso bo botle haholo ba mocheso le botsitso ba lik'hemik'hale, 'me mocheso oa ho bola oa mocheso o ka holimo ho 400 °C. Sehlahisoa sena se sebetsa hantle haholo se thibelang malakabe ebile se na le tikoloho. E ka fihlela litlhoko tsa tikoloho tsa European Union ka botlalo. E ka sebelisoa e le sehlaseli sa lelakabe tšimong ea laminate ea koporo. Ho phaella moo, sehlahisoa se na le kamano e ntle haholo le polyester le nylon, kahoo e na le spinnability e babatsehang ts'ebetsong ea ho ohla, thepa e ntle e tsoelang pele ea ho pota-pota le mebala, hape e sebelisoa haholo tšimong ea polyester le nylon.
| Lebitso | Kereiti No | Ponahalo | ho qhibiliha ntlha （℃) | P% % | N% (%) | Td5% (℃) | Thepa |
| Phosphazene flame retardant | DFE790 | Phofo e bosoeu kapa e mosehla | 108 ±4.0 | ≥13 | ≥6 | ≥320 | Likahare tse phahameng tsa phosphoms, ho thibela lelakabe, ho hanyetsa mocheso o phahameng, ho hanyetsa hydrolysis, ho loketse bakeng sa laminate ea koporo le masimo a mang. |
| Lebitso | Kereiti No | Ponahalo | dikahare % | ho qhibiliha ntlha CC) | P% % | Td2% V | Thepa |
| BIS-DOPO ethane | DFE791 | Phofo e tšoeu | ≥99 | 290-295 | ≥13 | ≥400 | Li-ion tsa chloride<20ppm, sebaka se qhibidihang haholo, maemo a matle haholo, e^ansion coefficient e tlase |
Letoto la Maleimide Resin
DFE930n DFE936> DFE937, DFE939^ DFE950 le DFE952 kaofela ke li-resin tsa grade maleimide tse nang le bohloeki bo phahameng, litšila tse fokolang le ho qhibiliha hantle. Ka lebaka la sebopeho sa lesale la imine ka molek'hule, li na le ho tiea ho matla le ho hanyetsa mocheso o babatsehang. Li sebelisoa haholo linthong tsa meralo ea sepakapaka, likarolo tsa sebopeho sa carbon fiber high heat, pente e sa keneleng mocheso o phahameng, laminate, laminates tse koahetsoeng ka koporo, polasetiki e bōpiloeng, joalo-joalo "boto, lisebelisoa tse sa senyeheng, sekhomaretsi sa lebili la daemane, lisebelisoa tsa makenete, likarolo tsa ho lahlela le lisebelisoa tse ling tse phahameng tsa theknoloji.
| Lebitso | Kereiti NO | Ponahalo | Ho qhibiliha ntlha (℃) | Boleng ba Asiti (mg KOH/g) | E feto-fetohang dikahare (%) | (5mm) Ho qhibiliha ha toluene e chesang (5mins) | Thepa |
| Kereiti ea motlakase Bismaleimide | DFE928 | Likaroloana tse tiileng tse mosehla | 158±2 | ≤3.0 | ≤0.3 | Ho qhibiliha ka ho feletseng | Ho hanyetsa mocheso o phahameng |
| Electronic grade diphenylmethane Bismaleimide | DFE929 | Maqephe a tiileng a mosehla o kganyang | 162 ±2 | ≤1.0 | ≤0.3 | Bohloeki bo phahameng le boleng ba acid e tlase | |
| Bismaleimide ea elektronike | DFE930 | Phofo e tšoeu e mosehla | 160 ±2 | ≤1.0 | ≤0.3 | Bohloeki bo phahameng aad acid e tlase^lue | |
| Bismaleimide e tlase ea kristale | DFE936 | 168 ±2 | ≤1.0 | ≤0.3 | Solubility e ntle | ||
| Bismaleimide e tlase ea dielectric le kristale e tlase | DFE937 | 168 ±2 | ≤1.0 | ≤0.3 | Solubility e ntle | ||
| Phenyl bismaleimide e nang le ntlha e tlase ea ho qhibiliha | DFE939 | Phofo e tiileng e bosootho bo bobebe kapa bo mosehla | Lilemo tse 50 10 | ≤3.0 | ≤0.3 | Solubility e ntle | |
| Polymaleimide e tlase e qhibilihang | DFE950 | 50 ±10 | ≤3.0 | ≤0.3 | Solubility e ntle | ||
| Tetramaleirnide e tlase ea meltmg ntlha | DFE952 | 50 ±10 | ≤3.0 | ≤0.3 | Solubility e ntle |
"E ipapisitse le 'maraka oa lehae le ho holisa khoebo ea mose ho maoatle" ke leano la rona la nts'etsopele bakeng sa fektheri ea China bakeng sa China CNMI Epoxy Resin crystal clear bakeng sa ho roala mabenyane a mabenyane a tafoleng ea noka ea mabenyane a mabenyane lebopong la mabenyane, U ka fumana theko e tlase haholo mona. Hape o tla fumana lintho tsa boleng bo holimo le lits'ebeletso tse ntle mona! Ka kopo le ka mohla u se ke ua emela hore u re tšoare!
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