| Litlhaloso tsa Tekheniki tsa Resin tse Mahareng le tse Ikhethang | ||||||||||||||||
| Sehlopha | Mohlala | 'Mala | Foromo | HEW (g/eq) | Sebaka sa ho Qhibiliha (℃) | Ntlha ea ho Nolofatsa (℃) | Chromaticity (G/H) | Ho tsikinyeha ha Khoune-Plate (P) | Phenol ea mahala (ppm) | Bohloeki (%) | Mohlala | Mokhoa oa ho Paka | Kopo | |||
| Batho ba mahareng | Phenolic Resin | Bisphenol A Phenolic Resin | EMTP322 | Ha e na 'mala ho isa ho Bosootho bo Bosootho bo Bosootho | E tiileng | - | - | 114-119 | G≤0.8 | 60-90 | ≤2000 | - |  | Mokotlana oa pampiri o nang le lesela la PE la kahare: 25 kg/mokotlana. | Li-intermediate tsa resin ea epoxy kapa li-curing agent li sebelisoa haholo li-laminate tsa elektroniki tse koahetsoeng ka koporo, liphuthelong tsa semiconductor le masimong a mang. | |
| Motheo Phenolic Resin | PF-2123 | Ho tloha Bosootho bo Bobebe ho isa ho bo Bofubelu | 100-105 | G:12-14 | - | ≤4 |  | Mokotlana oa pampiri o nang le lesela la PE la kahare: 25 kg/mokotlana. Mokotlana oa ton: 500kg/mokotlana | Lisebelisoa tsa ho brake le thepa ea khohlano tse kang li-brake pad bakeng sa literene, likoloi le lithuthuthu, phofo ea bakelite bakeng sa lihlahisoa tsa motlakase, likhomaretsi tsa mabone a mabone, mabili a ho sila a resin le lintho tse thibelang ho tsofala ha rabara bakeng sa ho sila le ho seha, likhomaretsi tsa lehlabathe tse bōpang, thepa e thibelang malakabe, jj. | |||||||
| ortho-Cresol Phenolic Resin | EMTP210 | Bosehla bo bobebe | 113-115 | G≤3 | 35-45 | 1000 | - | Mokotlana oa pampiri o nang le lesela la PE la kahare: 25 kg/mokotlana. | Li-intermediate tsa resin ea epoxy kapa li-curing agent li sebelisoa haholo li-laminate tsa elektroniki tse koahetsoeng ka koporo, liphuthelong tsa semiconductor le masimong a mang. | |||||||
| Tetraphenolethane ea TPN Phenolic Resin | EMTP110 | Sootho | 90-110 | 135-145 | G≤18 | - | ≤1000 | - | Epoxy resin e mahareng kapa e phekolang. | |||||||
| Bisphenol F | EMTP120 | Ho tloha bosweu ho isa bosoothong bo bofubelu | - | ≥105 | - | G<0.8 | 1000 | ≥88 | - | Dikarolo tse mahareng tse kang di-resin tsa epoxy tse nang le viscosity e tlase, di-resin tsa polycarbonate, di-resin tsa polyphenylene ether le di-polyester tse sa tlalang, mme di ka boela tsa sebediswa ho kopanya di-retantants tsa malakabe, di-antioxidants le di-plasticizer. | ||||||
| DCPD Phenolic Resin | EMTP100 | Bosootho bo bofubelu | 150-210 | - | 100-110 | G≤13 | ≤1000 | - | - | Laminate e koahetsoeng ka koporo ea elektroniki le masimo a mang. | ||||||
| Litlhaloso tsa Tekheniki tsa EMTD8700 Phosphazene Flame Retardant | ||||||||||||||||
| Sehlopha | Mohlala | 'Mala | Foromo | Sebaka sa ho Qhibiliha (℃) | Dikahare tse feto-fetohang (%) | Td5% (℃) | Dikahare tsa Fosforase (%) | Dikahare tsa naetrojene (%) | Mohlala | Mokhoa oa ho Paka | Kopo | |||||
| Phosphazene Flame Retardant | EMTD8700 | Lefatše le Lesoeu ho isa ho Lesehla le Letšo | E tiileng Phofo | 104-116 | ≤0.5 | ≥330 | ≥13 | ≥6 | - | Mokotlana oa pampiri o nang le lesela la PE la kahare: 25 kg/mokotlana. | Li-laminate tse koahetsoeng ka koporo, sekhomaretsi sa lipitsa tsa elektroniki, liphahlo tse sebetsang, polasetiki e thibelang malakabe le liindasteri tse ling. | |||||
| Litlhaloso tsa Tekheniki tsa Bismaleimide | ||||||||||||||||
| Sehlopha | Mohlala | 'Mala | Foromo | Sebaka sa ho Qhibiliha (℃) | Boleng ba Asiti (mgKOH/g) | Ho qhibiliha ha metsi | Mohlala | Mokhoa oa ho Paka | Kopo | |||||||
| Bismaleimide | Kereiti ea Elektroniki | EMTE505 | Bosehla bo Lerootho | E tiileng Phofo | ≥155 | ≤1 | E qhibiliha ka botlalo | - | Mokotlana oa pampiri ea kraft o kopantsoeng o nang le filimi kapa sephutheloana sa moqomo oa pampiri oa 25kg ka mokotlana/moqomo. | Lisebelisoa tsa sebopeho sa sefofane, likarolo tsa sebopeho tse hanelang mocheso o phahameng oa faeba ea khabone, pente ea ho kenngoa e hanelang mocheso o phahameng, li-laminate, li-laminate tse koahetsoeng ka koporo, polasetiki e bōpiloeng, liboto tsa potoloho tse hatisitsoeng tsa boemo bo holimo, thepa e hanelang ho tsofala, likhomaretsi tsa mabili a silang a taemane, thepa ea makenete, li-castings le lisebelisoa tse ling tse sebetsang le masimo a mang a theknoloji e phahameng. | ||||||
| Kereiti ea Motlakase | D929 | Bosootho Bosweu bo Bosehla | ≥155 | ≤1 | E qhibiliha ka botlalo | - | ||||||||||
