| Intermediates & Specialty Resin Technical Specifications | ||||||||||||||||
| Sehlopha | Mohlala | Mmala | Sebopeho | HLOMELA (g/eq) | Melting Point (℃) | Softening Ntlha (℃) | Chromaticity (G/H) | Cone-Plate Viscosity (P) | Phenol ea mahala (ppm) | Bohloeki (%) | Mohlala | Mokhoa oa ho paka | Kopo | |||
| Batsehare | Phenolic Resin | Bisphenol A Phenolic Resin | EMTP322 | Ha e na 'Mala ho ea ho Bosehla-Bosootho bo Sehla | Tiileng | － | － | 114-119 | G≤0.8 | 60-90 | ≤2000 | － |  | Mokotla oa pampiri o nang le PE liner e ka hare: 25 kg / mokotla. | Li-intermediate tsa epoxy resin kapa tse phekolang li sebelisoa haholo ho laminates tsa koporo ea elektroniki, liphutheloana tsa semiconductor le masimo a mang. | |
| Motheo Phenolic Resin | PF-2123 | Bosehla bo Khanyang ho ea ho Bosootho bo Bokhubetsoana | 100-105 | G:12-14 | － | ≤4 |  | Mokotla oa pampiri o nang le PE liner e ka hare: 25 kg / mokotla. Mokotla oa boima: 500kg / mokotla | Lisebelisoa tsa braking le lisebelisoa tsa likhohlano tse kang li-brake pads bakeng sa literene, likoloi le lithuthuthu, phofo ea bakelite bakeng sa lihlahisoa tsa motlakase, likhomaretsi tsa li-bulbs, mabili a silang a resin le lisebelisoa tse sa sebetseng tsa rabara bakeng sa ho sila le ho seha, likhomaretsi tsa lehlabathe, lisebelisoa tse thibelang mollo, jj. | |||||||
| ortho-Cresol Phenolic Resin | EMTP210 | Bosehla bo Khanyang | 113-115 | G≤3 | 35-45 | ＜1000 | － | Mokotla oa pampiri o nang le PE liner e ka hare: 25 kg / mokotla. | Li-intermediate tsa epoxy resin kapa tse phekolang li sebelisoa haholo ho laminates tsa koporo ea elektroniki, liphutheloana tsa semiconductor le masimo a mang. | |||||||
| TPN Tetraphenolethane Phenolic Resin | EMTP110 | Brown | 90-110 | 135-145 | G≤18 | － | ≤1000 | － | Epoxy resin e bohareng kapa e phekolang. | |||||||
| Bisphenol F | EMTP120 | E tšoeu ho ea ho Reddish Brown | － | ≥105 | － | G＜0.8 | ＜1000 | ≥88 | － | Li-intermediate tse kang low-viscosity epoxy resin, polycarbonate resin, polyphenylene ether resin le unsaturated polyester, 'me li ka boela tsa sebelisoa ho kopanya li-retardants tsa lelakabe, li-antioxidants le li-plasticizers. | ||||||
| DCPD Phenolic Resin | EMTP100 | Bofubelu bo bofubelu | 150-210 | － | 100-110 | G≤13 | ≤1000 | － | － | Electronic koporo clad laminate le masimo a mang. | ||||||
| EMTD8700 Phosphazene Flame Retardant Technical Specifications | ||||||||||||||||
| Sehlopha | Mohlala | Mmala | Sebopeho | Melting Point (℃) | Litaba tse sa fetoheng (%) | Td5% (℃) | Likahare tsa Phosphorus (%) | Likahare tsa naetrojene (%) | Mohlala | Mokhoa oa ho paka | Kopo | |||||
| Phosphazene Flame Retardant | EMTD8700 | Bosoeu ba Lefatše ho ea ho Bosehla bo Tletseng | Tiileng Phofo | 104-116 | ≤0.5 | ≥330 | ≥13 | ≥6 | － | Mokotla oa pampiri o nang le PE liner e ka hare: 25 kg / mokotla. | Li-laminate tsa koporo, sekhomaretsi sa pitsa ea elektronike, liaparo tse sebetsang hantle, lipolasetiki tse thibelang mollo le liindasteri tse ling. | |||||
| Litlhaloso tsa Botekgeniki tsa Bismaleimide | ||||||||||||||||
| Sehlopha | Mohlala | Mmala | Sebopeho | Melting Point (℃) | Boleng ba Asiti (mgKOH/g) | Solubility | Mohlala | Mokhoa oa ho paka | Kopo | |||||||
| Bismaleimide | Kereiti ea elektroniki | EMTE505 | Bosehla bo Botala | Tiileng Phofo | ≥155 | ≤1 | E qhibilihang ka ho Feletseng | － | Filimi e kentsoeng ka har'a mokotla oa pampiri oa kraft kapa sephutheloana sa moqomo oa pampiri 25kg ka mokotla / moqomo. | Aerospace thepa meralo, k'habone faeba mocheso phahameng manganga likarolo tsa sebopeho, mocheso phahameng manganga impregnation pente, laminates, koporo clad laminates, bōptjoa dipolasetiki, phahameng-grade hatisitsoeng oa potoloho mapolanka, apara-manganga thepa, taemane sila lebili sekgomaretsi, matla a khoheli, castings le lisebelisoa tse ling tse tshebetso le masimo a mang a theknoloji e phahameng. | ||||||
| Mophato wa Motlakase | D929 | Pale Bosehla-Bosoeu | ≥155 | ≤1 | E qhibilihang ka ho Feletseng | － | ||||||||||
