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Mofani oa Lefatše oa Tšireletso ea Tikoloho

Le Safety New Material Solutions

Intermediates & Specialty Resin Technical Specifications    
Sehlopha Mohlala Mmala Sebopeho HLOMELA
(g/eq)
Melting Point
(℃)
Softening Ntlha
(℃)
Chromaticity
(G/H)
Cone-Plate Viscosity
(P)
Phenol ea mahala
(ppm)
Bohloeki
(%)
Mohlala Mokhoa oa ho paka Kopo
Batsehare Phenolic Resin Bisphenol A
Phenolic Resin
EMTP322 Ha e na 'Mala ho ea ho Bosehla-Bosootho bo Sehla Tiileng 114-119 G≤0.8 60-90 ≤2000 Batsenagare1 Mokotla oa pampiri o nang le PE liner e ka hare: 25 kg / mokotla. Li-intermediate tsa epoxy resin kapa tse phekolang li sebelisoa haholo ho laminates tsa koporo ea elektroniki, liphutheloana tsa semiconductor le masimo a mang.
Motheo
Phenolic Resin
PF-2123 Bosehla bo Khanyang ho ea ho Bosootho bo Bokhubetsoana 100-105 G:12-14 ≤4 Batsenagare2 Mokotla oa pampiri o nang le PE liner e ka hare: 25 kg / mokotla. Mokotla oa boima: 500kg / mokotla Lisebelisoa tsa braking le lisebelisoa tsa likhohlano tse kang li-brake pads bakeng sa literene, likoloi le lithuthuthu, phofo ea bakelite bakeng sa lihlahisoa tsa motlakase, likhomaretsi tsa li-bulbs, mabili a silang a resin le lisebelisoa tse sa sebetseng tsa rabara bakeng sa ho sila le ho seha, likhomaretsi tsa lehlabathe, lisebelisoa tse thibelang mollo, jj.
ortho-Cresol
Phenolic Resin
EMTP210 Bosehla bo Khanyang 113-115 G≤3 35-45 <1000 Mokotla oa pampiri o nang le PE liner e ka hare: 25 kg / mokotla. Li-intermediate tsa epoxy resin kapa tse phekolang li sebelisoa haholo ho laminates tsa koporo ea elektroniki, liphutheloana tsa semiconductor le masimo a mang.
TPN Tetraphenolethane
Phenolic Resin
EMTP110 Brown 90-110 135-145 G≤18 ≤1000 Epoxy resin e bohareng kapa e phekolang.
Bisphenol F EMTP120 E tšoeu ho ea ho Reddish Brown ≥105 G<0.8 <1000 ≥88 Li-intermediate tse kang low-viscosity epoxy resin, polycarbonate resin, polyphenylene ether resin le unsaturated polyester, 'me li ka boela tsa sebelisoa ho kopanya li-retardants tsa lelakabe, li-antioxidants le li-plasticizers.
DCPD
Phenolic Resin
EMTP100 Bofubelu bo bofubelu 150-210 100-110 G≤13 ≤1000 Electronic koporo clad laminate le masimo a mang.
EMTD8700 Phosphazene Flame Retardant Technical Specifications    
Sehlopha Mohlala Mmala Sebopeho Melting Point
(℃)
Litaba tse sa fetoheng
(%)
Td5%
(℃)
Likahare tsa Phosphorus
(%)
Likahare tsa naetrojene
(%)
Mohlala Mokhoa oa ho paka Kopo
Phosphazene Flame Retardant EMTD8700 Bosoeu ba Lefatše ho ea ho Bosehla bo Tletseng Tiileng
Phofo
104-116 ≤0.5 ≥330 ≥13 ≥6 Mokotla oa pampiri o nang le PE liner e ka hare: 25 kg / mokotla. Li-laminate tsa koporo, sekhomaretsi sa pitsa ea elektronike, liaparo tse sebetsang hantle, lipolasetiki tse thibelang mollo le liindasteri tse ling.
Litlhaloso tsa Botekgeniki tsa Bismaleimide    
Sehlopha Mohlala Mmala Sebopeho Melting Point
(℃)
Boleng ba Asiti
(mgKOH/g)
Solubility Mohlala Mokhoa oa ho paka Kopo
Bismaleimide Kereiti ea elektroniki EMTE505 Bosehla bo Botala Tiileng
Phofo
≥155 ≤1 E qhibilihang ka ho Feletseng Filimi e kentsoeng ka har'a mokotla oa pampiri oa kraft kapa sephutheloana sa moqomo oa pampiri 25kg ka mokotla / moqomo. Aerospace thepa meralo, k'habone faeba mocheso phahameng manganga likarolo tsa sebopeho, mocheso phahameng manganga impregnation pente, laminates, koporo clad laminates, bōptjoa dipolasetiki, phahameng-grade hatisitsoeng oa potoloho mapolanka, apara-manganga thepa, taemane sila lebili sekgomaretsi, matla a khoheli, castings le lisebelisoa tse ling tse tshebetso le masimo a mang a theknoloji e phahameng.
Mophato wa Motlakase D929 Pale
Bosehla-Bosoeu
≥155 ≤1 E qhibilihang ka ho Feletseng

Tlohela Molaetsa wa Hao