Tlhaloso ea Sehlahisoa:
Filimi ea rona e omilenglifilimi tse thehiloeng ho polyesterli entsoe ho fihlela litlhoko tse thata tsa PCB (Printed Circuit Board) photolithography. E etselitsoe bakeng sa ho khomarela ho holimo le ho rarolla litšoantšo tse ntle haholo, lifilimi tsa rona li fana ka ts'ebetso e nepahetseng lits'ebetsong tse fapaneng. Re sebelisa mekhoa e tsoetseng pele ea tlhahiso, re etsa bonnete ba hore lifilimi tsa rona tsa polyester li fana ka boleng bo tsitsitseng le ho tšepahala. Ka sebopeho se ikhethileng se matlafatsang ho tšoarella le ho hanyetsa lik'hemik'hale, lihlahisoa tsa rona li loketse ho hlahisa lihlahisoa tse phahameng le meralo e rarahaneng. Lifilimi li bonolo ho sebetsana le tsona, li lumella ho sebetsa hantle ha PCB e etsoa.
Lisebelisoa tsa Sehlahisoa:
Tsenalifilimi tse thehiloeng ho polyesterli sebelisoa haholo indastering ea PCB bakeng sa lits'ebetso tsa photoresist, ho fana ka tharollo e tšepahalang bakeng sa mekhoa e rarahaneng ea potoloho. Ts'ebetso ea bona e holimo e na le molemo ka ho khetheha tikolohong e hlokang potoloho e nepahetseng le e qaqileng, e ba etsa tse loketseng lisebelisoa tsa elektroniki tsa bareki, lisebelisoa tsa likoloi le mechini ea indasteri. Ho feta moo, lifilimi tsa rona li tšehetsa mekhoa ea morao-rao ea miniaturization le li-inter-density interconnects, ho netefatsa hore bahlahisi ba ka finyella litlhoko tsa ho qetela tsa theknoloji ea morao-rao. Ka ho khetha lifilimi tsa rona tse omeletseng tse thehiloeng ho polyester, u tsetela ho boleng bo tsamaisang boqapi indastering ea PCB.
Setšoantšo sa moralo oafilimi e omileng ea polyester ea motheo ea filimikopo
Lebitso la Sehlahiswa le Mofuta:Filimi ea motheobakeng sa filimi e omileng ea Anti-corrosion GM90
Lintlha tsa Sehlahisoa sa Bohlokoa
Bohloeki bo botle, ponaletso e ntle, ponahalo e ntle.
Kopo e ka Sehloohong
E sebelisoa bakeng sa filimi e omileng ea PCB Anti-corrosion.
Sebopeho
Leqephe la lintlha
Botenya ba GM90 bo kenyelletsa: 15μm le 18μm.
LETLOTLO | THUTO | BOHLOKOA BA TLOAELE | TEKO MOKHOA | ||
TS'OANE | µm | 15 | 18 | ASTM D374 | |
MATLA A TŠEPE | MD | MPa | 211 | 203 | ASTM D882 |
TD | MPa | 257 | 259 | ||
TS'ELISO | MD | % | 147 | 154 | |
TD | % | 102 | 108 | ||
TS'OANE MOCHESO | MD | % | 1.30 | 1.18 | ASTM D1204 (150℃×30min) |
TD | % | 0.00 | 0.35 | ||
KOEFI KHOHANE | μs | - | 0.40 | 0.42 | ASTM D1894 |
μd | - | 0.33 | 0.30 | ||
PHEELLO | % | 90.3 | 90.6 | ASTM D1003 | |
HASE | % | 2.22 | 1.25 | ||
TSIETSO TS'OANE | dne/cm | 40 | 40 | ASTM D2578 | |
PONAHALO | - | OK | EMTCO MOKHOA | ||
TLHOKOMELO | Ka holimo ke litekanyetso tse tloaelehileng, eseng boleng ba tiiso. |
Teko ea tsitsipano ea ho koloba e sebetsa feela filiming e alafiloeng ke corona.
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Nako ea poso: Oct-14-2024