Kereiti | Mocheso | Likarolo tse ka Sehloohong |
3025 | E-105 ℃ | E hanana le ho roala |
3240 | B-130 ℃ |
|
3253 | H-180 ℃ | Matla a phahameng haholo a mocheso a tlase haholo, halogen-mahala |
D326 | H-180 ℃ | Matla a phahameng a mochini a tlase haholo |
D333 | C-200 ℃ | Matla a phahameng a mochini a tlase haholo |
3242 | F-155 ℃ |
|
D327 | F-155 ℃ | Ho boloka matla a mocheso a phahameng, V-1 |
D328 | F-155 ℃ | Ho boloka matla a mocheso a phahameng, V-0, UL, benzoxazine resin |
DF204 | F-155 ℃ | Ho boloka matla a mocheso a phahameng, V-0, UL, epoxy resin |
D331 | H-180 ℃ | Ho boloka matla a mocheso a phahameng, V-0, UL, benzoxazine resin |
D329 | H-180 ℃ | PTI ≥ 500V, V-0,halogen-mahala |
D338 | H-180 ℃ | V-0 |
D330 | B-130 ℃ | Semi-conductive, e ntšo |
D339 | F-155 ℃ | Semi-conductive, e ntšo |
D350A | H-180 ℃ | Ho boloka matla a mocheso a phahameng |
EPGC201 / 202 | B-130 ℃ | G10 / FR4 ( UL ) |
EPGC203 / 204 | F-155 ℃ | G11 / FR5 ( UL ) |
EPGC205 | F-155 ℃ | Glass roving plain loving lesela |
EPGC306 | F-155 ℃ | CTI ≥ 500V |
EPGC307 | F-155 ℃ | CTI ≥ 500V,Glass roving thota lesela la ho loha |
EPGC308 | H-180 ℃ | Ho hanyetsa haholo ka mor'a ho qoelisoa ka metsing |
DF3316A | C-200 ℃ | Ho hanyetsa mocheso o phahameng |
DF336 | F-155 ℃ | CTI ≥ 600V, V-0,halogen-mahala |
Kereiti | Mocheso | Likarolo tse ka Sehloohong |
D332 | F-155 ℃ | E hanana le ho roala |
D3524A | F-155 ℃ | E ntšo, e thibelang lelakabe, matla a phahameng |
DF3524B | F-155 ℃ | Boima bo tlase, bo thibelang lelakabe, bo sebelisoa e le lisebelisoa tsa mantlha |
D325 | - | Kevlar anti-stab board,Tshireletso ea ts'ireletso |
D295 | - | Prepreg. ea lesela la Kevlar bakeng sa lihelmete tsa ballistic, Tšireletso ea tšireletso |
D332 | F-155 ℃ | E hanana le ho roala |
G3849 | H-180 ℃ | E sebelisoa lisebelisoa tsa cryogenic (thempereichara e tlase ho -196 ℃) |
D3849 | F-155 ℃ | E sebelisoa lisebelisoa tsa cryogenic (thempereichara e tlase ho -196 ℃) |
Z3849 | B-130 ℃ | E sebelisoa lisebelisoa tsa cryogenic (thempereichara e tlase ho -196 ℃) |
DF3313L | B-130 ℃ | density e tlase, boima bo bobebe, Letlapa le letle la ho kenya mocheso |
DF3314O | F-155 ℃ | density e tlase, boima bo bobebe, Letlapa le letle la ho kenya mocheso |
Likarolo tse entsoeng ka mochini li entsoe haholo ka SMC, BMC, UPGM203 (GPO-3) prepreg, EPGC202 (FR4) le lisebelisoa tse ling tse tala ka ho tobetsa ho chesang kapa epoxy resin/epoxy vinyl resin/unsaturated polyester resin pultrusion forming.
Likarolo tse matlafalitsoeng tsa fiber e nang le boholo bo khethehileng ba boholo bo khethehileng
E sebetsa bakeng sa ho fehla matla a mocheso (phehlo ea matlakala a masepala, tlhahiso ea matla a khase e litšila)
Tshebetso | Yuniti | Litekanyetso | |
1 | Beng Strength(tloaelehileng) | MPa | ≥210 |
2 | Matla a ho Kobeha a Emeng (160℃±2℃) | MPa | ≥170 |
3 | Matla a Khatello | MPa | ≥320 |
4 | Matla a tšepe | MPa | ≥270 |
5 | AC Voltage ho hanyetsa | V/60s | 6000 |
Tshebetso | Yuniti | Litekanyetso | |
1 | Matla a Kobehang | MPa | ≥400 |
2 | Matla a ho tsieleha (ea holimo) | MPa | ≥300 |
3 | Laminar e emeng ea matla a motlakase (90 ℃ oli) | MV/m | ≥16.1 |
4 | CTI | V | ≥500 |
Tshebetso | unit | Litekanyetso | |
1 | Matla a kobehang | MPa | ≥400 |
2 | Compress Matla laminar e otlolohileng | MPa | ≥300 |
3 | Thermal shock 320℃/1h | __ | Ha ho de-lamination, bubble, resin e phallang |
4 | CTI |
| ≥50 |