Rigid Laminate & Machined Karolo
Laminate e thata
● Lipampiri Haholo-holo Bakeng sa Lisebelisoa tsa Motlakase
| Kereiti | Mocheso | Likarolo tse ka Sehloohong |
| 3025 | E-105 ℃ | E hanana le ho roala |
| 3240 | B-130 ℃ |
|
| 3253 | H-180 ℃ | Matla a phahameng haholo a mocheso a tlase haholo, halogen-mahala |
| D326 | H-180 ℃ | Matla a phahameng a mochini a tlase haholo |
| D333 | C-200 ℃ | Matla a phahameng a mochini a tlase haholo |
| 3242 | F-155 ℃ |
|
| D327 | F-155 ℃ | Ho boloka matla a mocheso a phahameng, V-1 |
| D328 | F-155 ℃ | Ho boloka matla a mocheso a phahameng, V-0, UL, benzoxazine resin |
| DF204 | F-155 ℃ | Ho boloka matla a mocheso a phahameng, V-0, UL, epoxy resin |
| D331 | H-180 ℃ | Ho boloka matla a mocheso a phahameng, V-0, UL, benzoxazine resin |
| D329 | H-180 ℃ | PTI ≥ 500V, V-0，halogen-mahala |
| D338 | H-180 ℃ | V-0 |
| D330 | B-130 ℃ | Semi-conductive, e ntšo |
| D339 | F-155 ℃ | Semi-conductive, e ntšo |
| D350A | H-180 ℃ | Ho boloka matla a mocheso a phahameng |
| EPGC201 / 202 | B-130 ℃ | G10 / FR4 ( UL ) |
| EPGC203 / 204 | F-155 ℃ | G11 / FR5 ( UL ) |
| EPGC205 | F-155 ℃ | Glass roving plain loving lesela |
| EPGC306 | F-155 ℃ | CTI ≥ 500V |
| EPGC307 | F-155 ℃ | CTI ≥ 500V，Glass roving thota lesela la ho loha |
| EPGC308 | H-180 ℃ | Ho hanyetsa haholo ka mor'a ho qoelisoa ka metsing |
| DF3316A | C-200 ℃ | Ho hanyetsa mocheso o phahameng |
| DF336 | F-155 ℃ | CTI ≥ 600V, V-0，halogen-mahala |
● Lipampiri tsa Lits'ebetso tseo e seng tsa Motlakase
| Kereiti | Mocheso | Likarolo tse ka Sehloohong |
| D332 | F-155 ℃ | E hanana le ho roala |
| D3524A | F-155 ℃ | E ntšo, e thibelang lelakabe, matla a phahameng |
| DF3524B | F-155 ℃ | Boima bo tlase, bo thibelang lelakabe, bo sebelisoa e le lisebelisoa tsa mantlha |
| D325 | - | Kevlar anti-stab board，Tshireletso ea ts'ireletso |
| D295 | - | Prepreg. ea lesela la Kevlar bakeng sa lihelmete tsa ballistic, Tšireletso ea tšireletso |
| D332 | F-155 ℃ | E hanana le ho roala |
| G3849 | H-180 ℃ | E sebelisoa lisebelisoa tsa cryogenic (thempereichara e tlase ho -196 ℃) |
| D3849 | F-155 ℃ | E sebelisoa lisebelisoa tsa cryogenic (thempereichara e tlase ho -196 ℃) |
| Z3849 | B-130 ℃ | E sebelisoa lisebelisoa tsa cryogenic (thempereichara e tlase ho -196 ℃) |
| DF3313L | B-130 ℃ | density e tlase, boima bo bobebe, Letlapa le letle la ho kenya mocheso |
| DF3314O | F-155 ℃ | density e tlase, boima bo bobebe, Letlapa le letle la ho kenya mocheso |
Karolo ea Machined
Likarolo tse entsoeng ka mochini li entsoe haholo ka SMC, BMC, UPGM203 (GPO-3) prepreg, EPGC202 (FR4) le lisebelisoa tse ling tse tala ka ho tobetsa ho chesang kapa epoxy resin/epoxy vinyl resin/unsaturated polyester resin pultrusion forming.
● 工 - Mofuta
● U - Mofuta
● L - Mofuta
● 王 - Mofuta
● Z - Mofuta
Lisebelisoa
Likarolo tse matlafalitsoeng tsa fiber e nang le boholo bo khethehileng ba boholo bo khethehileng
E sebetsa bakeng sa ho fehla matla a mocheso (phehlo ea matlakala a masepala, tlhahiso ea matla a khase e litšila)
● Slot Liner
| Tshebetso | Yuniti | Litekanyetso | |
| 1 | Beng Strength(tloaelehileng) | MPa | ≥210 |
| 2 | Matla a ho Kobeha a Emeng (160℃±2℃) | MPa | ≥170 |
| 3 | Matla a Khatello | MPa | ≥320 |
| 4 | Matla a tšepe | MPa | ≥270 |
| 5 | AC Voltage ho hanyetsa | V/60s | 6000 |
● Insulation Pad
| Tshebetso | Yuniti | Litekanyetso | |
| 1 | Matla a Kobehang | MPa | ≥400 |
| 2 | Matla a ho tsieleha (ea holimo) | MPa | ≥300 |
| 3 | Laminar e emeng ea matla a motlakase (90 ℃ oli) | MV/m | ≥16.1 |
| 4 | CTI | V | ≥500 |
● Insulation Sheath Ring
| Tshebetso | unit | Litekanyetso | |
| 1 | Matla a kobehang | MPa | ≥400 |
| 2 | Compress Matla laminar e otlolohileng | MPa | ≥300 |
| 3 | Thermal shock 320℃/1h | __ | Ha ho de-lamination, bubble, resin e phallang |
| 4 | CTI |
| ≥50 |
